Engineering

Fingerprint

Dive into the research topics where Engineering is active. These topic labels come from the works of this organization's members. Together they form a unique fingerprint.
View full fingerprint

Collaborations and top research areas from the last five years

Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Explore network further
View all 35 profiles

  • <monospace>PoisonedGNN</monospace> Backdoor Attack on Graph Neural Networks-based Hardware Security Systems

    Alrahis, L., Patnaik, S., Hanif, M. A., Shafique, M. & Sinanoglu, O., 2023, (Accepted/In press) In: IEEE Transactions on Computers. p. 1-13 13 p.

    Research output: Contribution to journal › Article › peer-review

  • 1stWorkshop on Maritime Computer Vision (MaCVi) 2023: Challenge Results

    Kiefer, B., Kristan, M., Pers, J., Zust, L., Poiesi, F., De Alcantara Andrade, F. A., Bernardino, A., Dawkins, M., Raitoharju, J., Quan, Y., Atmaca, A., Hofer, T., Zhang, Q., Xu, Y., Zhang, J., Tao, D., Sommer, L., Spraul, R., Zhao, H., Zhang, H., & 52 othersZhao, Y., Augustin, J. L., Jeon, E. I., Lee, I., Zedda, L., Loddo, A., Di Ruberto, C., Verma, S., Gupta, S., Muralidhara, S., Hegde, N., Xing, D., Evangeliou, N., Tzes, A., Bartl, V., Spanhel, J., Herout, A., Bhowmik, N., Breckon, T. P., Kundargi, S., Anvekar, T., Tabib, R. A., Mudengudi, U., Vats, A., Song, Y., Liu, D., Li, Y., Li, S., Tan, C., Lan, L., Somers, V., De Vleeschouwer, C., Alahi, A., Huang, H. W., Yang, C. Y., Hwang, J. N., Kim, P. K., Kim, K., Lee, K., Jiang, S., Li, H., Ziqiang, Z., Vu, T. A., Nguyen-Truong, H., Yeung, S. K., Jia, Z., Yang, S., Hsu, C. C., Hou, X. Y., Jhang, Y. A., Yang, S. & Yang, M. T., 2023, Proceedings - 2023 IEEE/CVF Winter Conference on Applications of Computer Vision Workshops, WACVW 2023. Institute of Electrical and Electronics Engineers Inc., p. 265-302 38 p. (Proceedings - 2023 IEEE/CVF Winter Conference on Applications of Computer Vision Workshops, WACVW 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • 3D shape analysis of lunar regolith simulants

    Peng, B., Hay, R. & Celik, K., Aug 1 2023, In: Powder Technology. 426, 118621.

    Research output: Contribution to journal › Article › peer-review

View all 5380 Research outputs