No photo of Davood Shahrjerdi

Davood Shahrjerdi

Associate Professor

    20032024

    Research activity per year

    Network

    Sanjay K. Banerjee

    • University of Texas at Austin
    • The Electrochemical Society
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    B. Hekmatshoar

    • University of Tehran
    • IBM
    • Princeton University
    • Department of Electrical Engineering
    • Thin Film Laboratory
    • Department of Electrical Engineering
    • Department of Electrical Engineering

    External person

    Devendra K. Sadana

    • IBM
    • IBM Research

    External person

    Abdullah Alharbi

    • New York University
    • King Abdulaziz City for Science and Technology
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Emanuel Tutuc

    • University of Texas at Austin
    • Princeton University
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    A. Khakifirooz

    • Massachusetts Institute of Technology
    • IBM Research
    • IBM
    • University of Tehran
    • Cypress Semiconductor
    • Microsystems Technology Laboratories
    • Department of Electrical Engineering
    • Thin Film Laboratory

    External person

    S. Mohajerzadeh

    • University of Tehran
    • Thin Film Laboratory
    • Department of Electrical Engineering
    • Department of Electrical Engineering

    External person

    Zhujun Huang

    • New York University
    • New York University-Tandon School of Engineering

    External person

    T. Wu

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Joy Sarkar

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    M. Robertson

    • Acadia University
    • University of Tehran
    • Department of Physics
    • Thin Film Laboratory

    External person

    Kenji Watanabe

    • Advanced Materials Laboratory
    • National Institute for Materials Science Tsukuba

    External person

    Takashi Taniguchi

    • National Institute for Materials Science Tsukuba
    • Advanced Materials Laboratory

    External person

    T. Akyol

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    Edoardo Cuniberto

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Kae Dyi You

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    D. I. Garcia-Gutierrez

    • SVTC Technologies
    • SEMATECH
    • Advanced Technology Development Facility
    • Advanced Technology Development Facility
    • Microelectronics Research Center
    • University of Texas at Austin
    • Microelectronics Research Center
    • ATDF

    External person

    Kim Kisslinger

    • Brookhaven National Laboratory
    • Center for Functional Nanomaterials

    External person

    K. Cheng

    • IBM Research
    • IBM

    External person

    J. Nah

    • Microelectronics Research Center
    • University of Texas at Austin
    • IBM
    • Microelectronics Research Center

    External person

    Jack C. Lee

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    Aaron D. Franklin

    • IBM
    • Duke University

    External person

    David Q. Kelly

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    A. Afzali-Kusha

    • University of Tehran
    • Department of Electrical Engineering
    • Department of Electrical Engineering

    External person

    Bayan Nasri

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    John G. Ekerdt

    • University of Texas at Austin
    • Department of Chemical Engineering
    • Department of Chemical Engineering
    • Department of Chemical Engineering

    External person

    J. Donnelly

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    Arjang Hassibi

    • University of Texas at Austin
    • Wireless Networking and Communications Group (WNCG)
    • InSilixa, Inc.

    External person

    Shawn S. Coffee

    • University of Texas at Austin
    • Department of Chemical Engineering
    • Department of Chemical Engineering

    External person

    Moeid Jamalzadeh

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Shan Tang

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    M. Ramon

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    K. Varahramyan

    • Microelectronics Research Center
    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    B. Doris

    • IBM Research
    • IBM

    External person

    Sagnik Dey

    • University of Texas at Austin

    External person

    Injo Ok

    • University of Texas at Austin

    External person

    P. Kulkarni

    • IBM Research
    • IBM

    External person

    A. Reznicek

    • IBM Research
    • IBM

    External person

    Jung Hwan Yum

    • University of Texas at Austin

    External person

    Arun Manickam

    • University of Texas at Austin
    • InSilixa, Inc.

    External person

    Feng Zhu

    • University of Texas at Austin

    External person

    Hyoung Sub Kim

    • University of Texas at Austin

    External person

    J. Kuss

    • IBM Research
    • IBM

    External person

    Chris Ebert

    • Veeco MOCVD
    • Veeco Corporation

    External person

    Rituraj Singh

    • InSilixa, Inc.
    • University of Texas at Austin

    External person

    Cheng Chih Hsieh

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Diana Huffaker

    • University of California at Los Angeles
    • University of New Mexico
    • NanoSystem Institute
    • Center for High Technology Materials

    External person

    N. Loubet

    • STMicroelectronics

    External person

    Michael M. Oye

    • Microelectronics Research Center
    • University of Texas at Austin
    • Department of Chemical Engineering
    • University of California at Santa Barbara

    External person

    Han Zhao

    • University of Texas at Austin

    External person

    Archie L. Holmes

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    D. Armstrong

    • New York University

    External person

    E. S. Liu

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Xiangyu Liu

    • Advanced Science Research Center (ASRC)
    • New York University
    • City University of New York
    • New York University-Tandon School of Engineering

    External person

    Javad Shabani

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Sunit Sebastian

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    G. Balakrishnan

    • University of New Mexico
    • Center for High Technology Materials
    • University of California at Los Angeles
    • NanoSystem Institute

    External person

    Yao Feng Chang

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Nicholas Wood

    • InSilixa, Inc.

    External person

    Eric Pop

    • Stanford University

    External person

    T. Adam

    • IBM Research
    • IBM

    External person

    Z. Zhu

    • IBM
    • IBM
    • IBM Research

    External person

    J. Gimbert

    • STMicroelectronics

    External person

    Nader Gamini

    • InSilixa, Inc.

    External person

    Annalisa Calò

    • Advanced Science Research Center
    • City University of New York
    • New York University
    • Advanced Science Research Center
    • Advanced Science Research Center (ASRC)
    • Institute for Bioengineering of Catalonia
    • University of Barcelona
    • New York University-Tandon School of Engineering

    External person

    R. Sreenivasan

    • IBM Research
    • IBM

    External person

    Eric A. Stach

    • Brookhaven National Laboratory
    • University of Pennsylvania

    External person

    Chin Sheng Pang

    • Purdue University

    External person

    Aaryn Tonita

    • Acadia University
    • Department of Physics

    External person

    S. Luning

    • Global Foundries, Inc.

    External person

    Manhong Zhang

    • University of Texas at Austin

    External person

    M. Jamil

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    Jeyavijayan Rajendran

    • New York University
    • Polytechnic University - Brooklyn
    • University of Texas at Dallas
    • Texas A&M University
    • University of Texas at Austin
    • School of Engineering
    • Erik Jonsson School of Engineering and Computer Science
    • Department of Electrical Engineering
    • Polytechnic Institute
    • Department Electrical and Computer Engineering
    • Electrical and Computer Engineering
    • Electrical Engineering
    • Polytechnic University - Brooklyn
    • Texas AandM University
    • NYU Wireless
    • University of Texas System
    • Texas A&M University
    • New York University-Tandon School of Engineering

    External person

    Zhihui Cheng

    • National Institute of Standards and Technology
    • Purdue University

    External person

    Terry J. Mattord

    • University of Texas at Austin

    External person

    S. Mehta

    • IBM Research
    • IBM

    External person

    Lian Mao Peng

    • Peking University

    External person

    Sachin Joshi

    • University of Texas at Austin

    External person

    Rahul Deshmukh

    • New York University
    • New York University-Tandon School of Engineering

    External person

    A. Khoshakhlagh

    • University of New Mexico
    • Center for High Technology Materials

    External person

    Yueran Liu

    • Spansion Company Ltd.
    • Microelectronics Research Center
    • University of Texas at Austin

    External person

    Curt A. Richter

    • National Institute of Standards and Technology

    External person

    Xiangfeng Duan

    • University of California at Los Angeles

    External person

    Peiqi Wang

    • University of California at Los Angeles

    External person

    Son T. Le

    • Theiss Research
    • National Institute of Standards and Technology
    • Theiss Research

    External person

    L. Colombo

    • Texas Instruments

    External person

    Jeffrey B. Hurst

    • University of Texas at Austin

    External person

    Scott K. Stanley

    • University of Texas at Austin
    • National Institute of Standards and Technology
    • Department of Chemical Engineering
    • Department of Chemical Engineering

    External person

    Yang Liu

    • InSilixa, Inc.

    External person

    Seyoung Kim

    • University of Texas at Austin

    External person

    F. Ferdousi

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Q. Liu

    • STMicroelectronics

    External person

    Wyatt A. Winkenwerder

    • University of Texas at Austin
    • Department of Chemical Engineering
    • Department of Chemical Engineering

    External person

    Mayank Gupta

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    H. He

    • IBM Research
    • IBM

    External person

    Joerg Appenzeller

    • Purdue University

    External person

    Zhihong Chen

    • Purdue University

    External person

    S. Holmes

    • IBM Research
    • IBM

    External person

    N. Nuntawong

    • University of New Mexico
    • Center for High Technology Materials

    External person

    Bahareh Sadeghi Makki

    • University of Tehran
    • Thin Film Laboratory
    • Department of Electrical Engineering

    External person

    M. Fathipour

    • University of Tehran

    External person

    Alexander James Wright

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Ebrahim Asl-Soleimani

    • University of Tehran
    • Thin Film Laboratory

    External person

    S. Ponoth

    • IBM Research
    • IBM

    External person

    Miguel Manzo-Perez

    • New York University-Tandon School of Engineering

    External person

    C. Aruta

    • Dipartimento di Scienze Fisiche
    • University of Rome Tor Vergata
    • INFM-Università di Roma Tor Vergata
    • European Synchrotron Radiation Facility
    • Advanced Science Research Center
    • National Research Council of Italy
    • City University of New York

    External person

    S. Schmitz

    • IBM
    • IBM Research

    External person

    Bassel H. Elfeky

    • New York University
    • New York University-Tandon School of Engineering

    External person

    E. Albisetti

    • Dipartimento di Fisica
    • Polytechnic University of Milan
    • City University of New York
    • Advanced Science Research Center
    • Georgia Institute of Technology
    • School of Physics
    • New York University
    • Advanced Science Research Center
    • Advanced Science Research Center (ASRC)
    • New York University-Tandon School of Engineering

    External person

    Steven J. Koester

    • Department of Electrical and Computer Engineering
    • University of Minnesota Twin Cities

    External person

    J. C. Bennett

    • Acadia University
    • Department of Physics

    External person

    Xiaorui Zheng

    • New York University
    • City University of New York
    • Westlake University
    • New York University-Tandon School of Engineering

    External person

    V. Kaushik

    • ATDF
    • SVTC Technologies

    External person

    S. R. Bank

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Iuliana Radu

    • Interuniversitair Micro-Elektronica Centrum

    External person

    Michael Knox

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Max C. Lemme

    • RWTH Aachen University
    • AMO GmbH

    External person

    Anupam Roy

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Robert G. Kuimelis

    • InSilixa, Inc.

    External person

    H. Bu

    • IBM Research
    • IBM

    External person

    Lei Pei

    • InSilixa, Inc.

    External person

    Tank Akyol

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Hashem Hassan Nasralla

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Ramkumar Ranjithkumar

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Arjuna Madanayake

    • University of Akron
    • Florida International University
    • Department of Electrical and Computer Engineering

    External person

    A. Goodarzi

    • Thin Film Laboratory
    • University of Tehran

    External person

    Tai De Li

    • Georgia Institute of Technology
    • School of Physics
    • School of Physics
    • School of Physics
    • City University of New York
    • Advanced Science Research Center

    External person

    Maryam Moradi

    • University of Waterloo
    • Department of Electrical Engineering

    External person

    E. Asl Soliemani

    • University of Tehran
    • Department of Electrical Engineering

    External person

    P. Jamison

    • IBM Research
    • IBM

    External person

    E. Vescovo

    • Brookhaven National Laboratory
    • National Synchrotron Light Source II

    External person

    S. Naczas

    • IBM Research
    • IBM

    External person

    Yameng Cao

    • Lancaster University
    • Department of Physics

    External person

    Sagnik Dey

    • University of Texas at Austin

    External person

    D. Qian

    • Shanghai Jiao Tong University
    • Princeton University
    • Department of Physics
    • Joseph Henry Laboratory of Physics
    • Department of Physics
    • Department of Physics
    • Department of Physics
    • Nanjing University
    • School of Physics and Astronomy
    • Collaborative Innovation Center of Advanced Microstructures

    External person

    Yong Hoon Kim

    • Korea Advanced Institute of Science and Technology

    External person

    Zhen Yao

    • University of Texas at Austin
    • Center for Nonlinear Dynamics

    External person

    Ghidewon Arefe

    • Department of Mechanical Engineering
    • Columbia University

    External person

    P. Khare

    • STMicroelectronics

    External person

    Bohan Wu

    • New York University
    • New York University-Tandon School of Engineering

    External person

    R. Johnson

    • IBM
    • IBM Research

    External person

    Devon Dyer

    • Veeco MOCVD

    External person

    Rongjie Li

    • Center for Cosmology and Particle Physics
    • New York University
    • New York University-Tandon School of Engineering

    External person

    Takashi Taniguchi

    • National Institute for Materials Science Tsukuba

    External person

    Sahar Ayazian

    • University of Texas at Austin

    External person

    Yasir J. Noori

    • Lancaster University
    • Department of Physics

    External person

    Xiaoni Zhang

    • Center for Cosmology and Particle Physics
    • New York University
    • New York University-Tandon School of Engineering

    External person

    Francesco Lavini

    • Advanced Science Research Center
    • New York University
    • City University of New York
    • CUNY Graduate Center
    • CUNY Graduate Center
    • New York University-Tandon School of Engineering

    External person

    K. Xiu

    • IBM
    • IBM
    • IBM Research

    External person

    L. Rezaee

    • University of Tehran
    • Department of Electrical Engineering

    External person

    D. Horak

    • IBM
    • IBM Research

    External person

    A. Akhavan

    • University of Waterloo

    External person

    B. Nasri

    • New York University

    External person

    Xiao Tong

    • Brookhaven National Laboratory
    • Center for Functional Nanomaterials

    External person

    Y. Abdi

    • University of Tehran
    • Thin Film Laboratory

    External person

    Qin Wu

    • Brookhaven National Laboratory
    • Center for Functional Nanomaterials

    External person

    Won Jong Yoo

    • Sungkyunkwan University

    External person

    Andras Kis

    • Electrical Engineering Institute
    • Swiss Federal Institute of Technology Lausanne

    External person

    Paul Masih Das

    • University of Pennsylvania

    External person

    S. C. Seo

    • IBM Research
    • IBM

    External person

    Tengfei Cao

    • Advanced Science Research Center
    • Department of Chemistry
    • City University of New York

    External person

    H. Hosseinzadegan

    • University of Tehran
    • Thin Film Laboratory

    External person

    O. Shoaei

    • University of Tehran
    • Thin Film Laboratory

    External person

    Ryong Gyu Lee

    • Korea Advanced Institute of Science and Technology

    External person

    Robert J. Young

    • Lancaster University
    • Department of Physics

    External person

    Andrew Patera

    • SUNY Downstate Health Sciences University
    • Mirimus Inc.

    External person

    B. S. Haran

    • IBM Research
    • IBM

    External person

    J. Nah

    • University of Texas at Austin
    • IBM
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    S. Ponoth

    • IBM Research

    External person

    Sung Il Park

    • University of Texas at Austin

    External person

    Yoocharn Jeon

    • Hewlett-Packard

    External person

    James Hone

    • Columbia University
    • Department of Mechanical Engineering

    External person

    L. H. Vanamurth

    • IBM Research
    • IBM

    External person

    Brian S. Lee

    • Department of Electrical Engineering
    • Columbia University

    External person

    N. N. Kulkarni

    • University of Texas at Austin

    External person

    V. Paruchuri

    • IBM Research
    • IBM

    External person

    Shao Cheng Hsu

    • New York University
    • New York University-Tandon School of Engineering

    External person

    A. Upham

    • IBM Research
    • IBM

    External person

    Mark W. McDermott

    • InSilixa, Inc.

    External person

    Mukesh Khare

    • Indian Institute of Technology Delhi
    • IBM Research

    External person

    Jerzy T. Sadowski

    • Brookhaven National Laboratory

    External person

    M. E. Rice

    • Department of Veterans Affairs
    • New York University
    • Department of Neuroscience and Physiology
    • Magnetophysiology Laboratory
    • Departments of Neuroscience and Physiology

    External person

    Joe C. Campbell

    • University of Texas at Austin

    External person

    Somayah Alharbi

    • New York University

    External person

    P. Kozlowski

    • IBM Research
    • IBM

    External person

    Insun Jo

    • University of Texas at Austin
    • Center for Nonlinear Dynamics

    External person

    Se Hoon Lee

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Konstantine Kaznatcheev

    • Brookhaven National Laboratory
    • National Synchrotron Light Source II

    External person

    Hong Yu Chen

    • Stanford University
    • Department of Electrical Engineering

    External person

    T. Maleki

    • University of Tehran
    • Thin Film Laboratory

    External person

    S. Darbari

    • University of Tehran
    • Thin Film Laboratory

    External person

    Christopher S. Woodhead

    • Lancaster University
    • Department of Physics

    External person

    Davide De Forni

    • ViroStatics S.r.l

    External person

    Xiaochi Liu

    • Sungkyunkwan University

    External person

    Suji Park

    • Brookhaven National Laboratory

    External person

    Chadwin D. Young

    • University of Texas at Dallas
    • Department of Materials Science and Engineering

    External person

    Manghong Zhang

    • University of Texas at Austin

    External person

    J. Li

    • IBM Research
    • IBM

    External person

    Thomas Rotter

    • University of California at Los Angeles
    • NanoSystem Institute

    External person

    Frank Lu

    • Veeco MOCVD

    External person

    J. O'Neill

    • IBM Research
    • IBM

    External person

    C. L. Reynolds

    • North Carolina State University
    • Department of Material Science and Engineering

    External person

    Leonard F. Register

    • University of Texas at Austin

    External person

    Xiaorui Zheng

    • New York University
    • City University of New York
    • Westlake University
    • New York University-Tandon School of Engineering

    External person

    Zoya Popovic

    • University of Colorado Boulder

    External person

    C. Ebert

    • Veeco Corporation
    • Veeco MOCVD

    External person

    Lin Miao

    • Center for Cosmology and Particle Physics
    • New York University
    • Lawrence Berkeley National Laboratory
    • Advanced Light Source, Berkeley
    • New York University-Tandon School of Engineering

    External person

    Kasra Sardashti

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Yue Wang

    • New York University

    External person

    Hai Liu

    • University of Texas at Austin

    External person

    Xiaochang Pei

    • New York University-Tandon School of Engineering

    External person

    Ali Moafi

    • University of Tehran
    • Department of Electrical Engineering

    External person

    Giuseppe Maria de Peppo

    • New York Stem Cell Foundation
    • New York University
    • Mirimus Inc.
    • New York University-Tandon School of Engineering

    External person

    T. A. Rawdanowicz

    • North Carolina State University
    • Department of Material Science and Engineering

    External person

    S. Fan

    • IBM Research
    • IBM

    External person

    Jason M. Reifsnider

    • Samsung Austin Semiconductor

    External person

    H. S Philip Wong

    • Stanford University
    • Department of Electrical Engineering
    • Taiwan Semiconductor Manufacturing Company

    External person

    Domingo Ferrer

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    A. Muller

    • University of Texas at Austin

    External person

    Thanuka Udumulla

    • New York University
    • Mirimus Inc.

    External person

    Ryan M. Feeley

    • New York University

    External person

    Jiyoon Song

    • Korea Advanced Institute of Science and Technology

    External person

    M. Kargar

    • University of Tehran
    • Thin Film Laboratory

    External person

    Martin Spieser

    • SwissLitho AG

    External person

    X. Gao

    • University of Texas at Austin

    External person

    Ziggy Pulwin

    • Veeco MOCVD

    External person

    James S. Harris

    • Solid State and Photonics Laboratory
    • Stanford University

    External person

    Michele Vittadello

    • City University of New York

    External person

    Utz Roedig

    • School of Computing and Communications
    • Lancaster University

    External person

    Shannon D. Lewis

    • University of Texas at Austin

    External person

    Julian Cheng

    • University of Texas at Austin

    External person

    Joline Uichanco

    • University of Michigan, Ann Arbor

    External person

    Percy Zahl

    • Brookhaven National Laboratory
    • Center for Functional Nanomaterials

    External person

    J. C. Patel

    • New York University
    • Department of Neuroscience and Physiology
    • Departments of Neuroscience and Physiology

    External person

    A. L. Beck

    • University of Texas at Austin

    External person

    M. Hasan

    • University of Texas at Austin

    External person

    Mehdi Hatefipour

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Vishal Narang

    • City University of New York

    External person

    T. Levin

    • IBM Research
    • IBM

    External person

    Mark A. Wistey

    • Stanford University
    • Solid State and Photonics Laboratory

    External person

    Xiaojun Yu

    • Stanford University
    • Solid State and Photonics Laboratory

    External person

    Alberto Ciarrocchi

    • Electrical Engineering Institute
    • Swiss Federal Institute of Technology Lausanne

    External person

    J. L. Herman

    • IBM Research

    External person

    Yanxiao Li

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Jeongwon Lee

    • Korea Advanced Institute of Science and Technology

    External person

    Dipankar Shakya

    • New York University
    • Lucent
    • New York University-Tandon School of Engineering

    External person

    M. Talaie

    • Thin Film Laboratory
    • University of Tehran

    External person

    Luca Stewart

    • Center for Cosmology and Particle Physics
    • New York University
    • New York University-Tandon School of Engineering

    External person

    D. McHerron

    • IBM Research
    • IBM

    External person

    Dmytro Nykypanchuk

    • Brookhaven National Laboratory

    External person

    Nitika Parashar

    • New York University
    • New York University-Tandon School of Engineering

    External person

    William P. King

    • University of Illinois at Urbana-Champaign
    • Department of Mechanical Science and Engineering
    • Department of Mechanical Science and Engineering
    • Department of Mechanical Science and Engineering
    • Department of Materials Science and Engineering
    • University of Illinis Urbana-Champaign
    • Department of Mechanical Science and Engineering
    • Department of Mechanical Science and Engineering
    • University of Illinois

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    Vladimir I. Fal'Ko

    • National Graphene Institute
    • University of Manchester

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    William Mayer

    • New York University
    • New York University-Tandon School of Engineering

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    L. F. Edge

    • IBM Research
    • IBM

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    Neda Lotfizadeh

    • New York University
    • New York University-Tandon School of Engineering

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    A. Kimball

    • IBM Research
    • IBM

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    Yanqing Wu

    • Peking University

    External person

    Shuai Nie

    • New York University
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
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    • University of Nebraska-Lincoln
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    M. Lipson

    • Cornell University
    • Department of Electrical Engineering
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    C. K. Shih

    • University of Texas at Austin

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    Hua Wang

    • Swiss Federal Institute of Technology Zurich

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    Ying Chen Chen

    • University of Texas at Austin
    • Microelectronics Research Center

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    Alexander J. Robson

    • Lancaster University
    • Department of Physics

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    Matthew D. Hannigan

    • New York University

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    Ramkumar Ranjitkumar

    • New York University

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    Kevin G. Yager

    • Brookhaven National Laboratory
    • Center for Functional Nanomaterials

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    Peng Yu

    • New York University
    • New York University-Tandon School of Engineering

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    John W. Harrold

    • City University of New York

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    L. Andrew Wray

    • Center for Cosmology and Particle Physics
    • New York University
    • New York University-Tandon School of Engineering

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    Marija Drndic

    • University of Pennsylvania

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    Ramón Bernardo-Gavito

    • Lancaster University
    • Department of Physics

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    Farinaz Koushanfar

    • Rice University
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    Yanqing Wu

    • Peking University
    • IBM
    • Huazhong University of Science and Technology

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    F. Monsieur

    • STMicroelectronics

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    S. Kim

    • University of Texas at Austin

    External person

    Jonathan Roberts

    • Lancaster University
    • Department of Physics

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    Erica Kotta

    • Center for Cosmology and Particle Physics
    • New York University
    • New York University-Tandon School of Engineering

    External person

    R. Sidhu

    • University of Texas at Austin

    External person

    S. Kanakasabapathy

    • IBM Research
    • IBM

    External person

    Arash Khajooeizadeh

    • University of Tehran
    • Thin Film Laboratory

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