No photo of Elza Erkip

Elza Erkip

Professor Electrical Engineering

    1995 …2025

    Research activity per year

    Network

    Deniz Gündüz

    • Stanford University
    • Imperial College London
    • Princeton University
    • Polytechnic University - Brooklyn
    • Catalan Telecommunications Technology Centre
    • Electrical and Electronic Engineering Department
    • Dept. of Electrical Engineering
    • Dept. of Electrical Engineering
    • IEEE
    • Department of Electrical Engineering
    • Department of Electrical Engineering
    • Department of Electrical Engineering
    • Department of Electrical Engineering
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • Dept. of Electrical Engineering
    • New York University-Tandon School of Engineering

    External person

    Osvaldo Simeone

    • New Jersey Institute of Technology
    • CWCSPR
    • Center for Wireless Communications
    • Center for Wireless Communications and Signal Processing Research (CWCSPR)
    • King's College London

    External person

    Shahram Shahsavari

    • NYU Tandon School of Engineering
    • New York University
    • Department Electrical and Computer Engineering
    • Department of Electrical and Computer Engineering
    • University of Waterloo
    • Huawei Research and Development Centre
    • New York University-Tandon School of Engineering

    External person

    H. Vincent Poor

    • Princeton University
    • Dept. of Electrical Engineering
    • Department of Electrical Engineering
    • Dept. of EE
    • Department of Electrical Engineering
    • Dept. of Electrical Engineering

    External person

    Farhad Shirani

    • New York University
    • Department Electrical and Computer Engineering
    • North Dakota State University
    • University of Michigan, Ann Arbor
    • New York University-Tandon School of Engineering

    External person

    Behnaam Aazhang

    • Rice University
    • University of Oulu
    • Eta Kappa Nu
    • University of Illinois at Urbana-Champaign
    • Department of Electrical and Computer Engineering
    • Center for Multimedia Communications
    • Department of Electrical and Computer Engineering
    • Department of Electrical Engineering
    • IEEE
    • Center for Multimedia Communications
    • Coordinated Science Laboratory
    • University of Illinois

    External person

    Melda Yuksel

    • TOBB University of Economics and Technology
    • Polytechnic University - Brooklyn
    • EEE Department
    • Electrical and Electronics Engineering Department
    • Electrical and Electronics Engineering Department
    • Polytechnic University - Brooklyn
    • New York University
    • Dept. of Electrical Engineering
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Abbas Khalili

    • New York University
    • Samsung Semiconductor
    • New York University-Tandon School of Engineering

    External person

    P. Hassanzadeh

    • New York University
    • J.P. Morgan Chase & Co.
    • J.P. Morgan AI Research
    • JPMorganChase Bank
    • New York University-Tandon School of Engineering

    External person

    Özgü Alay

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Shlomo Shamai

    • Technion-Israel Institute of Technology
    • Dept. of EE
    • Dept. of Electrical Engineering
    • Department of Electrical Engineering (EE)
    • Department of Electrical Engineering
    • Department of Electrical Engineering
    • Technion
    • Technion

    External person

    Xi Liu

    • Polytechnic University - Brooklyn
    • Broadcom
    • New York University
    • Polytechnic Institute
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • Broadcom Corporation
    • New York University-Tandon School of Engineering

    External person

    J. Llorca

    • Nokia
    • Alcatel-Lucent
    • Lucent
    • Bell Labs
    • Bell Labs
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    A. Tulino

    • University of Naples Federico II
    • Nokia
    • Alcatel-Lucent
    • Lucent
    • Bell Labs
    • Bell Labs
    • Department of Electrical and Information Technology Engineering
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Thanasis Korakis

    • Polythecnic University
    • Polytechnic University - Brooklyn
    • New York University
    • NYU Polytechnic School of Engineering
    • Polytechnic University
    • NYU Tandon School of Engineering
    • Department of Electrical and Computer Engineering
    • Department of Electrical and Computer Engineering
    • School of Engineering
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • NYU WIRELESS Research Center
    • NYU Wireless
    • New York University-Tandon School of Engineering

    External person

    Onur Sahin

    • New York University
    • Polytechnic University - Brooklyn
    • InterDigital Inc.
    • InterDigital Communications Corporation
    • Polytechnic University - Brooklyn
    • InterDigital, Inc.
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Yuanpeng Liu

    • New York University
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • NYU Wireless
    • New York University-Tandon School of Engineering

    External person

    Pei Liu

    • Polytechnic University
    • Polytechnic University - Brooklyn
    • NYU Polytechnic School of Engineering
    • New York University
    • Department of Electrical and Computer Engineering
    • Polytechnic Institute
    • Tandon School of Engineering
    • Department Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • NYU WIRELESS Research Center
    • InterDigital, Inc.
    • InterDigital Communications Corporation
    • New York University-Tandon School of Engineering

    External person

    Andrea Goldsmith

    • Stanford University
    • Department of Electrical Engineering
    • Dept. of Electrical Engineering
    • Dept. of Electrical Eng.
    • Princeton University

    External person

    Oner Orhan

    • Polytechnic University - Brooklyn
    • NYU Polytechnic School of Engineering
    • New York University
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Serhat Bakirtas

    • New York University
    • New York University-Tandon School of Engineering
    • Qualcomm Incorporated

    External person

    Xiaoan Lu

    • Thomson Corporate Research
    • Polytechnic University - Brooklyn
    • Polytechnic University
    • IEEE
    • Department of Electrical Engineering
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • 6 Metrotech Center
    • Dept. of Electrical Engineering
    • New York University-Tandon School of Engineering

    External person

    David J. Goodman

    • Polytechnic University - Brooklyn
    • IEEE
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • 6 Metrotech Center
    • Dept. of Electrical Engineering
    • New York University-Tandon School of Engineering

    External person

    Andrej Stefanov

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Kaǧan Bakanoǧlu

    • Polytechnic University - Brooklyn
    • New York University
    • Vestel Electronics
    • Research Department, Organize Sanayi Bölgesi
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • Vestel Electronics
    • New York University-Tandon School of Engineering

    External person

    Zinan Lin

    • Polytechnic University
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Yonina C. Eldar

    • Technion-Israel Institute of Technology
    • Department of Electrical Engineering
    • Weizmann Institute of Science
    • Dept. of Appl. Math. and Comp. Sci.
    • Technion

    External person

    Ezgi Özyilkan

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Ozgur Gurbuz

    • Sabanci University
    • Faculty of Engineering and Natural Sciences

    External person

    Mohammad A.Amir Khojastepour

    • New York University
    • NEC Laboratories America, Inc.
    • New York University-Tandon School of Engineering

    External person

    Jyotish Robin

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Fraida Fund

    • New York University
    • Polytechnic University - Brooklyn
    • NYU Polytechnic School of Engineering
    • NYU Tandon School of Engineering
    • Department of Electrical and Computer Engineering
    • Department Electrical and Computer Engineering
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • New York University-Tandon School of Engineering

    External person

    Felipe Gomez-Cuba

    • University of Vigo
    • University of Padua
    • Stanford University

    External person

    Fabrizio Carpi

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Michele Zorzi

    • University of Padua
    • NYU Tandon School of Engineering
    • Department of Information Engineering
    • Information Engineering Department
    • New York University
    • Department of Electronic Systems
    • Aalborg University
    • New York University-Tandon School of Engineering

    External person

    Anna Scaglione

    • Cornell University
    • University of California at Davis
    • ECE Department
    • Arizona State University
    • School of Electrical

    External person

    Andrej Stefanov

    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn

    External person

    Chun Nie

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic Institute
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Zhili Guo

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Feilu Liu

    • Polytechnic University - Brooklyn
    • Polytechnic University
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • Qualcomm Incorporated
    • New York University-Tandon School of Engineering

    External person

    Farideh Ebrahim Rezagah

    • Polytechnic University - Brooklyn
    • New York University
    • NYU Tandon School of Engineering
    • School of Engineering
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • Goldman Sachs Group
    • Goldman Sachs and Co.
    • New York University-Tandon School of Engineering

    External person

    Thomas M. Cover

    • Stanford University
    • Rice University
    • Departments of Statistics and Electrical Engineering

    External person

    A. Sendonaris

    • Rice University
    • Qualcomm Incorporated
    • Department of Electrical and Computer Engineering

    External person

    Sennur Ulukus

    • University of Maryland, College Park
    • Department of Electrical and Computer Engineering

    External person

    Ashutosh Sabharwal

    • Rice University

    External person

    Kaibin Huang

    • The University of Hong Kong
    • Department of Electrical and Electronic Engineering

    External person

    Petar Popovski

    • University of Padua
    • Aalborg University
    • Antennas
    • Department of Electronic Systems
    • Department of Electronic Systems

    External person

    Joseph R. Cavallaro

    • Rice University
    • Eta Kappa Nu
    • Department of Electrical and Computer Engineering
    • Center for Multimedia Communications
    • IEEE

    External person

    Jinfeng Du

    • Massachusetts Institute of Technology
    • Lucent
    • KTH Royal Institute of Technology

    External person

    Suman Das

    • Rice University
    • IEEE
    • Lucent
    • Nokia

    External person

    Muriel Médard

    • Massachusetts Institute of Technology

    External person

    Rui Yang

    • InterDigital Communications Corporation
    • InterDigital Inc.
    • Inter Digitel Communiction, LLC
    • InterDigital, Inc.

    External person

    Chris T K Ng

    • Alcatel-Lucent
    • Stanford University
    • Bell Laboratories
    • Department of Electrical Engineering
    • Dept. of Electrical Engineering
    • Lucent

    External person

    Oren Somekh

    • Princeton University
    • Dept. of EE
    • Dept. of Electrical Engineering

    External person

    P. Castiglione

    • Signal and Information Processing Dept.
    • FTW
    • Forschungszentrum Telekommunikation Wien

    External person

    Thomas L. Marzetta

    • New York University
    • Florida International University
    • New York University-Tandon School of Engineering

    External person

    M. Sarper Gokturk

    • Sabanci University

    External person

    Shirin Jalali

    • Nokia
    • Alcatel-Lucent
    • Lucent
    • Bell Labs

    External person

    Pulkit Grover

    • Carnegie Mellon University

    External person

    Krishna Kiran Mukkavilli

    • Qualcomm Incorporated
    • Rice University
    • Department of Electrical and Computer Engineering

    External person

    T. Zemen

    • Signal and Information Processing Dept.
    • FTW
    • Forschungszentrum Telekommunikation Wien

    External person

    Lalitha Sankar

    • Princeton University
    • Department of Electrical Engineering
    • Department of Electrical Engineering

    External person

    Mustafa Anil Kocak

    • New York University
    • School of Engineering
    • Department Electrical and Computer Engineering
    • Broad Institute
    • New York University-Tandon School of Engineering

    External person

    Erdem Bala

    • InterDigital Communications Corporation
    • InterDigital, Inc.

    External person

    David Ramirez

    • New York University
    • Princeton University
    • New York University-Tandon School of Engineering

    External person

    Aylin Yener

    • Pennsylvania State University Hershey
    • Pennsylvania State University
    • Department of Electrical Engineering

    External person

    Francesco Verde

    • University of Naples Federico II
    • Department of Biomedical, Electronic and Telecommunication Engineering (DIBET)

    External person

    Oguzhan Kubilay Ulger

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Mark Rodwell

    • University of California at Santa Barbara

    External person

    James F. Buckwalter

    • University of California at Santa Barbara
    • Department of Electrical and Computer Engineering
    • New York University
    • New York University-Tandon School of Engineering

    External person

    Yijie Mao

    • ShanghaiTech University

    External person

    Dusit Niyato

    • Nanyang Technological University

    External person

    Eduard A. Jorswieck

    • Technical University of Braunschweig

    External person

    Qianqian Yang

    • Electrical and Electronic Engineering Department
    • Imperial College London

    External person

    Luca Barletta

    • Polytechnic University of Milan

    External person

    Amee Trivedi

    • University of British Columbia

    External person

    Jinhong Yuan

    • University of New South Wales

    External person

    Jayanth Nayak

    • Mayachitra, Inc.
    • University of California at Riverside
    • Mayachitra, Inc.

    External person

    Mahshad Shariatnasab

    • North Dakota State University

    External person

    Johannes Ballé

    • New York University
    • Center for Neural Science
    • Center for Neural Science
    • Howard Hughes Medical Institute
    • Center for Neural Science
    • Center for Neural Science
    • Alphabet Inc.

    External person

    A. C. Lozano

    • Lucent
    • Massachusetts Institute of Technology
    • UPF
    • Pompeu Fabra University

    External person

    Hossein Shokri-Ghadikolaei

    • KTH Royal Institute of Technology
    • Electrical Engineering

    External person

    Alexandros Manolakos

    • Stanford University
    • Department of Electrical Engineering
    • Qualcomm Incorporated

    External person

    Xiaofeng Xu

    • Polytechnic University - Brooklyn
    • Polytechnic Univ.
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Sourjya Dutta

    • New York University
    • NYU Wireless
    • Qualcomm Incorporated
    • New York University-Tandon School of Engineering

    External person

    Monisha Ghosh

    • Philips Research
    • Koninklijke Philips N.V.
    • University of Notre Dame

    External person

    Akshaj Veldanda

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Farshad Lahouti

    • California Institute of Technology
    • School of Electrical and Computer Engineering
    • University of Tehran
    • Department of Electrical Engineering

    External person

    Carlo Fischione

    • KTH Royal Institute of Technology
    • Electrical Engineering
    • School of Electrical Engineering

    External person

    Stefano Rini

    • National Yang Ming Chiao Tung University

    External person

    Xiaohu Shang

    • Alcatel-Lucent
    • Syracuse University
    • Princeton University
    • Bell Laboratories
    • Department of Electrical Engineering
    • Dept. of Electrical Engineering
    • Lucent

    External person

    Ertem Tuncel

    • University of California at Riverside
    • Department of Electrical Engineering

    External person

    Samyak Rawlekar

    • New York University
    • University of Illinois
    • New York University-Tandon School of Engineering

    External person

    Roghayeh Joda

    • Iran Telecommunication Research Center
    • New York University
    • Department of Communication Technology
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Bruno Clerckx

    • Imperial College London
    • Silicon Austria Labs GmbH

    External person

    Gábor Fodor

    • KTH Royal Institute of Technology
    • Ericsson AB
    • Electrical Engineering
    • Ericsson Research

    External person

    Lifeng Lai

    • Princeton University
    • University of Arkansas Little Rock
    • Department of Electrical Engineering
    • Department of Systems Engineering
    • University of Arkansas System
    • University of Arkansas at Little Rock

    External person

    Dinesh Rajan

    • Southern Methodist University
    • Rice University
    • Department of Electrical Engineering

    External person

    David J. Love

    • Purdue University

    External person

    Yijia Fan

    • Princeton University
    • Department of Electrical Engineering
    • Department of Electrical Engineering

    External person

    Robert W. Heath

    • University of Texas at Austin
    • Wireless Networking and Communications Group (WNCG)
    • Wireless Networking and Communications Group (WNCG)
    • University of Texas System
    • North Carolina State University

    External person

    Stefano Tomasin

    • University of Padua
    • Department of Information Engineering
    • Department of Information Engineering

    External person

    Zhongzheng Yuan

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Jeff Zhang

    • Harvard University
    • New York University
    • New York University-Tandon School of Engineering

    External person

    Mustafa Riza Akdeniz

    • New York University
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • NYU Wireless
    • New York University-Tandon School of Engineering

    External person

    Hoi Yin Shutoy

    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Zhifeng Tao

    • Polytechnic University
    • Polytechnic University - Brooklyn
    • Mitsubishi Electric Research USA
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • Dept. of Electrical Engineering
    • Mitsubishi Electric Corporation
    • New York University-Tandon School of Engineering

    External person

    Ali Mohammad Fouladgar

    • New Jersey Institute of Technology
    • CWCSPR
    • Center for Wireless Communications and Signal Processing Research (CWCSPR)

    External person

    Mingsheng Yin

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Mihaela C. Beluri

    • InterDigital Communications Corporation
    • InterDigital, Inc.

    External person

    Navid Hosseinzadeh

    • University of California at Santa Barbara

    External person

    Panagiotis Skrimponis

    • New York University
    • Pi-Radio
    • Nyu
    • New York University-Tandon School of Engineering

    External person

    Federico Boccardi

    • Ofcom
    • Ofcom
    • Ofcom
    • Ofcom
    • Ofcom
    • Ofcom

    External person

    Efe Onaran

    • New York University
    • School of Engineering
    • New York University-Tandon School of Engineering

    External person

    Mainak Chowdhury

    • Stanford University
    • Department of Electrical Engineering
    • ZaiNar Inc.

    External person

    Yaqi Hu

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Nirmal Shende

    • Polytechnic University - Brooklyn
    • Cornell University
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Michael Knox

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Shuguang Cui

    • University of California at Davis

    External person

    Marios Kountouris

    • Huawei Technologies Co., Ltd.
    • Mathematical and Algorithmic Sciences Lab

    External person

    Kai Pfeiffer

    • New York University
    • Nanyang Technological University
    • New York University-Tandon School of Engineering

    External person

    Ozlem Yildiz

    • New York University
    • New York University-Tandon School of Engineering
    • Samsung

    External person

    Meixia Tao

    • Shanghai Jiao Tong University

    External person

    Michael B. Wakin

    • University of Michigan, Ann Arbor
    • University of Michigan Health Systems
    • Colorade School of Mines
    • Colorado School of Mines

    External person

    Victor DeBrunner

    • Florida State University

    External person

    Mohammad A. Amir Khojastepour

    • NEC Laboratories America, Inc.

    External person

    Xiaozhong Xu

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Çaǧdaş Bilen

    • New York University
    • Department Electrical and Computer Engineering
    • Dept. of Electrical Engineering
    • New York University-Tandon School of Engineering

    External person

    Mehrdad Nosrati

    • Space Exploration Technologies Corporation
    • Stevens Institute of Technology

    External person

    S. Amir Hosseini

    • Blue Danube Systems

    External person

    Farideh Ebrahim Rezagah

    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Piya Pal

    • University of California at San Diego

    External person

    Shu Sun

    • New York University
    • Polytechnic University - Brooklyn
    • Qualcomm Incorporated
    • NYU Wireless
    • NYU Tandon School of Engineering
    • NYU WIRELESS Research Center
    • School of Engineering
    • NYU WIRELESS and Tandon School of Engineering
    • Intel
    • NYU Wireless
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Seok Hwan Park

    • Dept. of Elect. Engineering
    • Jeonbuk National University

    External person

    Arnab Chakrabarti

    • Qualcomm Incorporated

    External person

    Jian Lin

    • Georgia Institute of Technology
    • New York University
    • New York University-Tandon School of Engineering

    External person

    Roy Yates

    • Rutgers - The State University of New Jersey, New Brunswick

    External person

    Michael B. Matthews

    • ATK Mission Research
    • Mission Research Corporation
    • Northrop Grumman

    External person

    Brett Kaufman

    • University of Oulu
    • Center for Multimedia Communications
    • Rice University

    External person

    Giuseppe Caire

    • University of Southern California
    • Ming Hsieh Department of Electrical Engineering
    • Technical University of Berlin

    External person

    Fatih Berkay Sarpkaya

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Geir E. Øien

    • Institutt for Elektronikk og Telekommunikasjon

    External person

    Yue Lu

    • Harvard University

    External person

    Jerry D. Gibson

    • University of California at Santa Barbara

    External person

    Jim Schroeder

    • L3Harris Technologies, Inc.

    External person

    Mingjun Ying

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Mathew K. Samimi

    • New York University
    • Polytechnic University - Brooklyn
    • NYU Polytechnic School of Engineering
    • NYU Wireless
    • NYU Tandon School of Engineering
    • NYU WIRELESS Research Center
    • Polytechnic University - Brooklyn
    • NYU Wireless
    • Department Electrical and Computer Engineering
    • NYU WIRELESS and Tandon School of Engineering
    • New York University-Tandon School of Engineering

    External person

    Dana Brooks

    • Northeastern University

    External person

    Frank Kragh

    • Naval Postgraduate School
    • Naval Postgraduate School

    External person

    Kyle Guan

    • BAE Systems

    External person

    Sanjay Goyal

    • New York University
    • Polytechnic University - Brooklyn
    • NYU Polytechnic School of Engineering
    • Tandon School of Engineering
    • Polytechnic Institute
    • InterDigital Communications Corporation
    • Polytechnic University - Brooklyn
    • InterDigital, Inc.
    • Department Electrical and Computer Engineering
    • Indian Institute of Technology Kanpur
    • New York University-Tandon School of Engineering

    External person

    Joerg Kliewer

    • New Jersey Institute of Technology

    External person

    Ran Ding

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Charlie Jianzhong Zhang

    • Samsung
    • Samsung Advanced Institute of Technology

    External person

    Hongbin Li

    • Stevens Institute of Technology

    External person

    Jorma Lilleberg

    • Nokia
    • Center for Multimedia Communications
    • Rice University
    • University of Oulu

    External person

    Yiiantao Wu

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Wonho Lee

    • University of California at Santa Barbara

    External person

    Seongjoon Kang

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Jie Yang

    • Worcester Polytechnic Institute

    External person

    Mahyar Shirvanimoghadam

    • University of Sydney

    External person

    Lee Swindelhurst

    • University of California at Irvine

    External person

    Hans Jürgen Zepernick

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Giuseppe Durisi

    • Chalmers University of Technology

    External person

    Selim F. Yilmaz

    • Imperial College London

    External person

    Vahid Jamali

    • Friedrich-Alexander University Erlangen-Nürnberg

    External person

    Luqin Wang

    • Polytechnic University - Brooklyn
    • New York University
    • Department of Computer Science and Engineering
    • Polytechnic University - Brooklyn
    • New York University-Tandon School of Engineering

    External person

    Natasha Devroye

    • University of Illinois at Chicago

    External person

    Stratis Ioannidis

    • Technicolor
    • Technicolor
    • Northeastern University

    External person

    Murali Tummala

    • Naval Postgraduate School
    • Naval Postgraduate School

    External person

    R. Srikant

    • University of Illinois at Urbana-Champaign

    External person

    Xin Pan

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Reza Ghanadan

    • BAE Systems

    External person

    Matthieu R. Bloch

    • Georgia Institute of Technology

    External person

    Jianzhong Zhang

    • University of Southern California
    • Samsung Advanced Institute of Technology
    • Samsung

    External person

    Stella Batalama

    • SUNY Buffalo

    External person

    Trung Q. Duong

    • New York University
    • Queen's University Belfast
    • Blekinge Institute of Technology
    • New York University-Tandon School of Engineering

    External person

    Monique P. Farques

    • Naval Postgraduate School
    • Naval Postgraduate School

    External person

    Yuze Jia

    • New York University
    • New York University-Tandon School of Engineering

    External person

    D. Richard Brown

    • Stanford University

    External person

    Michele Wigger

    • Télécom Paris

    External person

    Chris Ng

    • Blue Danube Systems

    External person

    Marco Mezzavilla

    • NYU Poly
    • New York University
    • University of Padua
    • NYU Polytechnic School of Engineering
    • NYU Tandon School of Engineering
    • School of Engineering
    • Tandon School of Engineering
    • NYU Wireless
    • New York University-Tandon School of Engineering
    • Polytechnic University of Milan

    External person

    Maite Brandt-Pearce

    • University of Virginia

    External person

    Eyyüp Taşçı

    • Bogazici University

    External person

    Michal Yemini

    • Princeton University

    External person

    F. J. González-Castaño

    • Gradiant
    • University of Vigo
    • Departamento de Enxeñaría Telemática
    • Departamento de Ingeniería Telemática
    • ETSE Telecomunicación, Campus

    External person

    Earl E. Swartzlander

    • University of Texas at Austin

    External person

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