No photo of Yong Liu

Yong Liu

Professor Electrical Engineering

    1997 …2024

    Research activity per year

    Network

    Chao Liang

    • Polytechnic University - Brooklyn
    • Alcatel-Lucent
    • New York University
    • Polytechnic Institute
    • IEEE
    • Polytechnic University - Brooklyn
    • Nokia
    • Department Electrical and Computer Engineering
    • Apple
    • New York University-Tandon School of Engineering

    External person

    Yang Guo

    • Alcatel-Lucent
    • Thomson Corporate Research
    • Thomson Inc.
    • Technicolor Research and Innovation
    • Bell Laboratories
    • Corporate Research
    • Bell Labs
    • Bell Labs
    • Department of Service Infrastructure Research
    • Lucent
    • Nokia
    • Thomson Reuters

    External person

    Donald F. Towsley

    • University of Massachusetts
    • Polytechnic University - Brooklyn
    • California State Polytechnic University Pomona
    • Department of Computer Science
    • Dept. of Elec. and Comp. Engineering
    • Computer Science Department
    • Dept of Comput & Inf Sci, Univ
    • Polytechnic Inst of New York,
    • Polytechnic University - Brooklyn
    • New York University
    • College of Information and Computer Sciences
    • New York University-Tandon School of Engineering

    External person

    Weibo Gong

    • University of Massachusetts
    • Department of Electrical Engineering
    • Dept. of Elec. and Comp. Engineering

    External person

    Houwei Cao

    • New York Institute of Technology

    External person

    Liyang Sun

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Yang Xu

    • New York University
    • New York University
    • Department Electrical and Computer Engineering
    • Polytechnic Institute
    • Fudan University
    • NYU Wireless
    • School of Computer Science
    • Peng Cheng Laboratory
    • New York University-Tandon School of Engineering

    External person

    Tongyu Zong

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Guangyu Li

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Hao Ding

    • New York University
    • 6 Metrotech Center
    • Department Electrical and Computer Engineering
    • Oath Inc.
    • New York University-Tandon School of Engineering

    External person

    Di Wu

    • School of Information Science and Technology
    • Sun Yat-Sen University
    • Department of Computer Science
    • New York University
    • Dept. of Comp./Information Science
    • CMU Shunde International Joint Research Institute
    • New York University-Tandon School of Engineering

    External person

    Guibin Tian

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Xiwang Yang

    • New York University
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Eymen Kurdoglu

    • NYU Polytechnic School of Engineering
    • New York University
    • Tandon School of Engineering
    • Department of Electrical and Computer Engineering
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Hao Hu

    • New York University
    • Polytechnic Institute of NYU Economics
    • Polytechnic University - Brooklyn
    • Cisco Systems
    • Advanced Architecture and Research
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Vishal Misra

    • Columbia University
    • Department of Computer Science
    • Department of Computer Science

    External person

    Tan Le

    • Polytechnic University - Brooklyn
    • New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Can Yang

    • South China University of Technology
    • College of Computer Science and Engineering
    • School of Computer Science and Engineering

    External person

    Yu Gu

    • University of Massachusetts
    • Department of Computer Science

    External person

    Xiaojun Hei

    • Polytechnic University - Brooklyn
    • Huazhong University of Science and Technology
    • Department of Electronics and Information Engineering
    • Dept. of Comp. and Info. Science
    • IEEE
    • Polytechnic University - Brooklyn
    • New York University
    • Dept. of Comp./Information Science
    • New York University-Tandon School of Engineering

    External person

    Hang Shi

    • Huawei Technologies Co., Ltd.
    • Huawei

    External person

    David Dai

    • Huawei Technologies Co., Ltd.
    • Huawei
    • Futurewei Technologies, Inc.

    External person

    Chenguang Yu

    • New York University
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Fanyi Duanmu

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Yishuai Chen

    • Beijing Jiaotong University
    • School of Electrical and Information Engineering

    External person

    Baoxian Zhang

    • Chinese Academy of Sciences
    • College of Comp. and Commun. Eng.
    • Research Center of Ubiquitous Sensor Networks
    • University of Chinese Academy of Sciences

    External person

    Jin Li

    • Huawei Technologies Co., Ltd.

    External person

    Hang Liu

    • Technicolor Corporate Research
    • Catholic University of America
    • Thomson Corporate Research
    • Thomson Inc.
    • Corporate Research
    • Corporate Research Lab.
    • Department of Electrical Engineering and Computer Science
    • Thomson Reuters

    External person

    Chen Li

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Sha Hua

    • New York University
    • Qualcomm Research
    • Polytechnic University - Brooklyn
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • Qualcomm Incorporated
    • New York University-Tandon School of Engineering

    External person

    Ratan Dey

    • New York University
    • Polytechnic University - Brooklyn
    • Polytechnic Institute
    • Polytechnic Institute of New York
    • Department of Computer Science and Engineering
    • Polytechnic University - Brooklyn
    • Department of Computer Science and Engineering
    • New York University-Tandon School of Engineering

    External person

    Chun Zhang

    • University of Massachusetts
    • IBM
    • Department of Computer Science

    External person

    Lifan Mei

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Zhenghua Fu

    • IBM
    • Barclays Capital
    • Barclays

    External person

    Harald Steck

    • Netflix, Inc.
    • Lucent

    External person

    Feng Li

    • Huawei Technologies Co., Ltd.

    External person

    Michael Zink

    • University of Massachusetts
    • Department of Computer Science
    • Dept. of Elec. and Comp. Engineering

    External person

    Yixiang Mao

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Haifeng Qian

    • East China Normal University
    • Department of Computer Science

    External person

    Ye Tian

    • University of Science and Technology of China
    • Anhui Key Lab. of High Performance Computing
    • Key Laboratory on High Performance Computing

    External person

    Minhui Xue

    • NYU Shanghai
    • East China Normal University
    • NYU Shanghai
    • NYU Shanghai Shanghai 200122 China
    • New York University Shanghai
    • New York University Shanghai
    • Department of Computer Science
    • University of Adelaide

    External person

    Qihu Yuan

    • College of Computer Science and Engineering
    • South China University of Technology
    • NetEase Computer System Company Ltd.

    External person

    Chenguang Yu

    • New York University
    • 6 Metrotech Center

    External person

    Jia Huang

    • Drexel University

    External person

    Honggang Zhang

    • University of Massachusetts
    • Zhejiang University
    • Department of Computer Science
    • Fordham University

    External person

    Wei Zhu

    • PPLive Inc.

    External person

    Yinghua Ye

    • Huawei Technologies Co., Ltd.

    External person

    Jingjiang Li

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Zifa Han

    • Huawei Technologies Co., Ltd.

    External person

    Songlin Cai

    • University of Massachusetts
    • Department of Electrical Engineering

    External person

    Changjia Chen

    • Beijing Jiaotong University
    • School of Electronic and Information Engineering

    External person

    Rajeev Kumar

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Francesco L. Presti

    • University of L'Aquila
    • Dipartimento di Informatica

    External person

    Siquan Wang

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Bruno Ribeiro

    • Purdue University

    External person

    Xinggong Zhang

    • Peking University
    • Institute of Computer Science and Technology

    External person

    Jim Kurose

    • Department of Computer Science
    • University of Massachusetts

    External person

    Richard Li

    • Huawei Technologies Co., Ltd.
    • Future Networks at Huawei

    External person

    Zhengye Liu

    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University
    • AT&T
    • Polytechnic University
    • Dept. of Electrical and Computer Engineering
    • Polytechnic Institute
    • Polytechnic Univ.
    • Department of Computer Science and Engineering
    • ECE Department
    • Polytechnic University - Brooklyn
    • Department of Computer Science and Engineering
    • Department Electrical and Computer Engineering
    • Tandon School of Engineering
    • New York University-Tandon School of Engineering

    External person

    Guanyu Zhu

    • New York University

    External person

    Zongming Guo

    • Peking University
    • Institute of Computer Science and Technology

    External person

    Jelena Mirkovic

    • University of Southern California

    External person

    Robert Margolies

    • AT&T
    • Alphabet Inc.

    External person

    Runchen Hu

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Miao Zhao

    • Stony Brook University
    • Hong Kong Polytechnic University
    • Department of Computing
    • Department of Electrical and Computer Engineering

    External person

    Honggang Zhang

    • Department of Computer Science
    • University of Massachusetts
    • Fordham University

    External person

    Yongxiang Zhao

    • Beijing Jiaotong University
    • School of Electronic and Information Engineering

    External person

    Lan Wang

    • South China University of Technology

    External person

    Yanming Shen

    • Dalian University of Technology
    • Polytechnic University
    • Polytechnic University - Brooklyn
    • New York University
    • Polytechnic University
    • Polytechnic University
    • Polytechnic University
    • Polytechnic University
    • Computer Science and Engineering Department
    • Dept. of Electrical and Computer Engineering
    • School of Computer Science and Technology
    • Department of Electrical and Computer Engineering
    • School of Computer Science and Technology
    • Department of Electrical and Computer Engineering
    • School of CST
    • ECE Department
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Yang Zhao

    • University of Science and Technology of China

    External person

    Yang Li

    • Sina Weibo

    External person

    Cong Wang

    • University of Massachusetts

    External person

    Keqiu Li

    • Dalian University of Technology

    External person

    Jean Bolot

    • Sprint ATL
    • Technicolor
    • Sprint Nextel

    External person

    Weizhe Yuan

    • New York University

    External person

    Daniel Bo Wei Chen

    • Princeton University

    External person

    Thanasis Korakis

    • Polythecnic University
    • Polytechnic University - Brooklyn
    • New York University
    • NYU Polytechnic School of Engineering
    • Polytechnic University
    • NYU Tandon School of Engineering
    • Department of Electrical and Computer Engineering
    • Department of Electrical and Computer Engineering
    • School of Engineering
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • Department Electrical and Computer Engineering
    • NYU WIRELESS Research Center
    • NYU Wireless
    • New York University-Tandon School of Engineering

    External person

    Weixi Zhang

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Chenchen Gu

    • Tencent Co. Ltd.
    • Tencent

    External person

    C. V. Hollot

    • University of Massachusetts
    • Dept. of Elec. and Comp. Engineering

    External person

    Qiang Shen

    • New York University

    External person

    Bo Yan

    • New York University
    • AT&T
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Feng Xie

    • ZTE Inc.
    • ZTE Corporation

    External person

    Xing Chen

    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • Department of Electrical and Computer Engineering, Polytechnic Institute of New York University
    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Yujin Cai

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Jian Liang

    • New York University
    • W.M. Keck Lab. for Biomol. Imaging
    • Department of Chemistry

    External person

    Yang Xu

    • New York University

    External person

    Tilman Wolf

    • University of Massachusetts
    • Dept. of Elec. and Comp. Engineering

    External person

    Ying Huang

    • China University of Geosciences, Wuhan
    • Department of Communication Engineering
    • China University of Geosciences

    External person

    Weibo Gongt

    • University of Massachusetts
    • Dept. of Elec. and Comp. Engineering

    External person

    Jian Liang

    • Polytechnic University - Brooklyn
    • Dept. of Comp. and Info. Science
    • Dept. of Comp. and Info. Sci.
    • Polytechnic University - Brooklyn
    • New York University
    • Dept. of Comp./Information Science
    • New York University-Tandon School of Engineering

    External person

    Xiang Yu

    • SUNY Buffalo
    • Dept. of Comp. Sci. and Engineering

    External person

    Xiao Yi

    • Wuhan Road-bridge Management Center

    External person

    Jim Kurose

    • University of Massachusetts
    • Department of Computer Science

    External person

    C. Li

    • New York University
    • Center for Urban Science + Progress
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Jinrui Gou

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Zhiyong Huang

    • Chongqing University
    • College of Communication Engineering

    External person

    Yong Huang

    • Dept. of Elec. and Comp. Engineering
    • University of Massachusetts

    External person

    Markus Mobius

    • Harvard University
    • National Bureau of Economic Research

    External person

    Yan Cai

    • University of Massachusetts
    • Dept. of Elec. and Comp. Engineering

    External person

    Rakesh Kumar

    • New York University
    • Department Electrical and Computer Engineering
    • Center for Advanced Technology in Telecommunicatios
    • Dept. of Electrical Engineering
    • Polytechnic University
    • New York University-Tandon School of Engineering

    External person

    Xiaoping Zeng

    • Chongqing University
    • College of Communication Engineering

    External person

    Xiaohua Hu

    • Drexel University

    External person

    Angela Wang

    • New York University-Tandon School of Engineering

    External person

    John Buford

    • Princeton University
    • Panasonic Holdings Corporation
    • Avaya Inc
    • Panasonic

    External person

    Zheng Xue

    • CMU Shunde International Joint Research Institute
    • Sun Yat-Sen University
    • Department of Computer Science

    External person

    Xiang Deng

    • Sun Yat-Sen University

    External person

    S. Amir Hosseini

    • New York University
    • School of Engineering
    • Tandon School of Engineering
    • Department Electrical and Computer Engineering
    • Blue Danube Systems
    • NYU WIRELESS Research Center
    • NYU Wireless
    • New York University-Tandon School of Engineering

    External person

    Xiaotian Li

    • New York University

    External person

    Bin Nie

    • Fordham University

    External person

    Yuchun Guo

    • Beijing Jiaotong University

    External person

    Chunxi Li

    • Beijing Jiaotong University
    • School of Electronic and Information Engineering

    External person

    Zifan Han

    • Huawei Technologies Co., Ltd.

    External person

    Hongyun Wang

    • University of California at Santa Cruz
    • University of California at Berkeley
    • Dept. of Molec. and Cellular Biology
    • Dept. of Appl. Math. and Statistics

    External person

    Lina Qiu

    • New York University

    External person

    Zhisheng Yan

    • George Mason University

    External person

    Haihong Zhu

    • Futurewei Technologies

    External person

    Junlin Zhang

    • Sina Weibo

    External person

    Tao Ye

    • Sprint ATL
    • Sprint Nextel

    External person

    Jiang Yu

    • New York University

    External person

    Tian Bu

    • Alcatel-Lucent
    • Bell Laboratories
    • Lucent

    External person

    Sanjay K. Banerjee

    • University of Texas at Austin
    • The Electrochemical Society
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    Luqin Wang

    • Polytechnic University - Brooklyn
    • New York University
    • Department of Computer Science and Engineering
    • Polytechnic University - Brooklyn
    • New York University-Tandon School of Engineering

    External person

    Yuan Ding

    • New York University
    • Polytechnic University - Brooklyn
    • Department of Computer Science and Engineering
    • Polytechnic Institute of New York
    • Computer Science and Engineering
    • Polytechnic Institute
    • Polytechnic University - Brooklyn
    • Department of Computer Science and Engineering
    • New York University-Tandon School of Engineering

    External person

    Yining Liu

    • Dalian University of Technology

    External person

    Junlun Ma

    • Sun Yat-Sen University

    External person

    Yuanyuan Lei

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Xiaoyu Wang

    • New York University

    External person

    Chunming Qiao

    • SUNY Buffalo
    • Dept. of Comp. Sci. and Engineering

    External person

    Jian He

    • SYSU-CMU
    • CMU Shunde International Joint Research Institute
    • Sun Yat-Sen University
    • Department of Computer Science
    • CMU Shunde International Joint Research Institute

    External person

    Prashant Shenoy

    • University of Massachusetts
    • Dept. of Elec. and Comp. Engineering

    External person

    Yuanyuan Lei

    • New York University
    • New York University-Tandon School of Engineering

    External person

    Luqin Wang

    • New York University
    • Department of Computer Science and Engineering

    External person

    Fraida Fund

    • New York University
    • Polytechnic University - Brooklyn
    • NYU Polytechnic School of Engineering
    • NYU Tandon School of Engineering
    • Department of Electrical and Computer Engineering
    • Department Electrical and Computer Engineering
    • Department of Electrical and Computer Engineering
    • Polytechnic University - Brooklyn
    • New York University-Tandon School of Engineering

    External person

    Sixuan Ren

    • College of Computer Science and Engineering
    • South China University of Technology

    External person

    Trishank Karthik Kuppusamy

    • New York University
    • NYU Polytechnic School of Engineering
    • Datadog
    • Datadog
    • Department of Computer Science and Engineering
    • Computer Science Department
    • Datadog Inc.
    • New York University-Tandon School of Engineering

    External person

    Jianyin Zhang

    • China Mobile Communications
    • Department of Network Technology
    • China Mobile Communications Group Co., Ltd.

    External person

    Kate Lin

    • National Yang Ming Chiao Tung University

    External person

    Zifan Yu

    • Wuhan University

    External person

    Qiang Gong

    • Beijing Jiaotong University

    External person

    David Q. Kelly

    • University of Texas at Austin
    • Microelectronics Research Center

    External person

    Joy Sarkar

    • University of Texas at Austin
    • Microelectronics Research Center
    • Microelectronics Research Center

    External person

    Bo Liu

    • New York University
    • Department Electrical and Computer Engineering
    • New York University-Tandon School of Engineering

    External person

    Robert Moll

    • University of Massachusetts
    • Department of Computer Science

    External person

    Wen Ji

    • CAS - Institute of Computing Technology

    External person

    Madhurya Nangia

    • New York University

    External person

    Haoqin He

    • New York University

    External person

    Jing Lyu

    • Tencent Co. Ltd.
    • Tencent

    External person

    Hongwei Wang

    • Hong Kong Polytechnic University
    • Shanghai Jiao Tong University
    • Department of Computing
    • Department of Computer Science and Engineering
    • University of Illinois at Urbana-Champaign

    External person

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