TY - GEN
T1 - 135GHz CMOS / LTCC MIMO Receiver Array Tile Modules
AU - Farid, Ali A.
AU - Ahmed, A. S.H.
AU - Dhananjay, A.
AU - Skrimponis, Panagiotis
AU - Rangan, Sundeep
AU - Rodwell, Mark
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - We report 135GHz MIMO receiver array tile modules. The module integrate four or eight RF channels on an LTCC carrier, each channel having a 22nm SOI CMOS IC for RF - baseband and a linear microstrip patch antenna array; DC, baseband IQ and LO reference signal connections are by printed circuit board connected to the LTCC carrier. Digital beamforming is demonstrated with the 8-element array, showing 12° 3-dB beam width and 56° angular steering range, and with the 4-element array, showing 12° 3-dB beam width and 20° angular steering range before the appearance of grating lobes. The 4-element arrays, in single-beam operation, shows -15.7 dB RMS error vector magnitude receiving 1.34Gb/s QPSK data, and shows -15.6dB error vector magnitude receiving 1.92Gb/s 16QAM data.
AB - We report 135GHz MIMO receiver array tile modules. The module integrate four or eight RF channels on an LTCC carrier, each channel having a 22nm SOI CMOS IC for RF - baseband and a linear microstrip patch antenna array; DC, baseband IQ and LO reference signal connections are by printed circuit board connected to the LTCC carrier. Digital beamforming is demonstrated with the 8-element array, showing 12° 3-dB beam width and 56° angular steering range, and with the 4-element array, showing 12° 3-dB beam width and 20° angular steering range before the appearance of grating lobes. The 4-element arrays, in single-beam operation, shows -15.7 dB RMS error vector magnitude receiving 1.34Gb/s QPSK data, and shows -15.6dB error vector magnitude receiving 1.92Gb/s 16QAM data.
KW - D-band receiver
KW - Heterogeneously integrated receivers
KW - MIMO receiver
KW - millimeter wave packaging
UR - http://www.scopus.com/inward/record.url?scp=85125812852&partnerID=8YFLogxK
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U2 - 10.1109/BCICTS50416.2021.9682493
DO - 10.1109/BCICTS50416.2021.9682493
M3 - Conference contribution
AN - SCOPUS:85125812852
T3 - 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2021
BT - 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2021
Y2 - 5 December 2021 through 8 December 2021
ER -