@inproceedings{e94c5d3d1df940bdaf69a6d53d5e3b14,
title = "3D Integration: Another Dimension Toward Hardware Security",
abstract = "We review threats and selected schemes concerning hardware security at design and manufacturing time as well as at runtime. We find that 3D integration can serve well to enhance the resilience of different hardware security schemes, but it also requires thoughtful use of the options provided by the umbrella term of 3D integration. Toward enforcing security at runtime, we envision secure 2.5D system-level integration of untrusted chips and 'all around' shielding for 3D ICs.",
keywords = "3D Integration, Hardware Security",
author = "Johann Knechtel and Satwik Patnaik and Ozgur Sinanoglu",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 25th IEEE International Symposium on On-Line Testing and Robust System Design, IOLTS 2019 ; Conference date: 01-07-2019 Through 03-07-2019",
year = "2019",
month = jul,
doi = "10.1109/IOLTS.2019.8854395",
language = "English (US)",
series = "2019 IEEE 25th International Symposium on On-Line Testing and Robust System Design, IOLTS 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "147--150",
editor = "Dimitris Gizopoulos and Dan Alexandrescu and Panagiota Papavramidou and Michail Maniatakos",
booktitle = "2019 IEEE 25th International Symposium on On-Line Testing and Robust System Design, IOLTS 2019",
}