A Frequency-Splitting-Based Wireless Power and Data Transfer IC for Neural Prostheses with Simultaneous 115mWPower and 2.5Mb/s Forward Data Delivery

Yechan Park, Seok Tae Koh, Jeongeun Lee, Hongkyun Kim, Jaesuk Choi, Sohmyung Ha, Chul Kim, Minkyu Je

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The electrical cochlear implants (Cls) have given > 500,000 patients worldwide a better life to date. However, the electrical neural stimulation has limited spatial resolution due to the spread of stimulation current, which reduces the number of effective channels to < 10 and results in a restricted perception of sound. Recently developed CIs such as optogenetic Cls have overcome this limitation, enabling much higher effective channel count [1]. However, such CIs require much larger power consumption (>100mW) and a higher data transmission rate (>lMb/s) than conventional Cls. As a result, designing a simultaneous wireless power and data transfer (SWPDT) system becomes challenging. AIso, due to the short distance between transmitter (TX) and receiver (RX) coils separated only by a scalp, frequency splitting may occur, and it should be carefully considered.

Original languageEnglish (US)
Title of host publication2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages472-474
Number of pages3
ISBN (Electronic)9781728195490
DOIs
StatePublished - Feb 13 2021
Event2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - San Francisco, United States
Duration: Feb 13 2021Feb 22 2021

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume64
ISSN (Print)0193-6530

Conference

Conference2021 IEEE International Solid-State Circuits Conference, ISSCC 2021
Country/TerritoryUnited States
CitySan Francisco
Period2/13/212/22/21

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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