TY - GEN
T1 - A microstrip array fed by a nonhomogeneous stripline feeding network
AU - Herscovici, N. I.
AU - Das, N. K.
AU - Klugman, J.
N1 - Publisher Copyright:
© 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - Using high-dielectric plugs instead of via-holes eliminates the need for ohmic contact, which sometimes is difficult to ensure in the vias. This technological process requires one less plating round which considerably reduces the price of the product. All the layers are simultaneously processed and bonded together in the same way stripline circuits are. A 4×4 microstrip array fed by a feeding network which makes use of this new technology was built and tested. The implementation of this technique at 66 GHz is being considered.
AB - Using high-dielectric plugs instead of via-holes eliminates the need for ohmic contact, which sometimes is difficult to ensure in the vias. This technological process requires one less plating round which considerably reduces the price of the product. All the layers are simultaneously processed and bonded together in the same way stripline circuits are. A 4×4 microstrip array fed by a feeding network which makes use of this new technology was built and tested. The implementation of this technique at 66 GHz is being considered.
UR - http://www.scopus.com/inward/record.url?scp=85046837328&partnerID=8YFLogxK
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U2 - 10.1109/MSMW.1998.755525
DO - 10.1109/MSMW.1998.755525
M3 - Conference contribution
AN - SCOPUS:85046837328
T3 - 3rd International Kharkov Symposium "Physics and Engineering of Millimeter and Submillimeter Waves", MSMW 1998 - Symposium Proceedings
SP - 592
EP - 594
BT - 3rd International Kharkov Symposium "Physics and Engineering of Millimeter and Submillimeter Waves", MSMW 1998 - Symposium Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Kharkov Symposium on Physics and Engineering of Millimeter and Submillimeter Waves, MSMW 1998
Y2 - 15 September 1998 through 17 September 1998
ER -