A microstrip array fed by a nonhomogeneous stripline feeding network

N. I. Herscovici, N. K. Das, J. Klugman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Using high-dielectric plugs instead of via-holes eliminates the need for ohmic contact, which sometimes is difficult to ensure in the vias. This technological process requires one less plating round which considerably reduces the price of the product. All the layers are simultaneously processed and bonded together in the same way stripline circuits are. A 4×4 microstrip array fed by a feeding network which makes use of this new technology was built and tested. The implementation of this technique at 66 GHz is being considered.

Original languageEnglish (US)
Title of host publication3rd International Kharkov Symposium "Physics and Engineering of Millimeter and Submillimeter Waves", MSMW 1998 - Symposium Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages592-594
Number of pages3
ISBN (Electronic)0780355539, 9780780355538
DOIs
StatePublished - 1998
Event3rd International Kharkov Symposium on Physics and Engineering of Millimeter and Submillimeter Waves, MSMW 1998 - Kharkov, Ukraine
Duration: Sep 15 1998Sep 17 1998

Publication series

Name3rd International Kharkov Symposium "Physics and Engineering of Millimeter and Submillimeter Waves", MSMW 1998 - Symposium Proceedings
Volume2

Conference

Conference3rd International Kharkov Symposium on Physics and Engineering of Millimeter and Submillimeter Waves, MSMW 1998
Country/TerritoryUkraine
CityKharkov
Period9/15/989/17/98

ASJC Scopus subject areas

  • Radiation
  • Instrumentation
  • Computer Networks and Communications

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