@inproceedings{82a06c678db3417798db7753531da35b,
title = "Abetting Planned Obsolescence by Aging 3D Networks-on-Chip",
abstract = "We set up a security analysis framework by aging the Network-on-Chip (NoC) to study planned obsolescence by the original equipment manufacturer (OEM). An NoC is the communication backbone in a manycore System-on-Chip (SoC). Planned obsolescence may adopt any vulnerability in the NoC to cause the SoC to fail. We show how an OEM can craft workloads to generate electromigration-induced stress and crosstalk noise in TSV-based vertical links in the NoC to hasten failure. We analyzed three malicious workloads and confirm that a crafted workload that injects 3-10% more traffic on to a few selected critical vertical links can shorten the lifetime of the NoC by 11%-25% averaged over the benchmarks considered in this work.",
keywords = "3D NoC, EDP, Electromigration, Energy, Hardware Attack, Latency, Security, TSV",
author = "Sourav Das and Kanad Basu and Doppa, {Janardhan Rao} and Pande, {Partha Pratim} and Ramesh Karri and Krishnendu Chakrabarty",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 12th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2018 ; Conference date: 04-10-2018 Through 05-10-2018",
year = "2018",
month = oct,
day = "26",
doi = "10.1109/NOCS.2018.8512162",
language = "English (US)",
series = "2018 12th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2018 12th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2018",
}