Advanced flexible electronics: Challenges and opportunities

Stephen W. Bedell, Davood Shahrjerdi, Keith Fogel, Paul Lauro, Can Bayram, Bahman Hekmatshoar, Ning Li, John Ott, Devendra Sadana

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.

Original languageEnglish (US)
Title of host publicationMicro- and Nanotechnology Sensors, Systems, and Applications VI
PublisherSPIE
ISBN (Print)9781628410204
DOIs
StatePublished - 2014
EventMicro- and Nanotechnology Sensors, Systems, and Applications VI - Baltimore, MD, United States
Duration: May 5 2014May 9 2014

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9083
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherMicro- and Nanotechnology Sensors, Systems, and Applications VI
CountryUnited States
CityBaltimore, MD
Period5/5/145/9/14

Keywords

  • Flexible circuits
  • Fracture
  • Gallium nitride
  • Layer transfer
  • Photovoltaics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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