Abstract
In the modeling studies of processing of composites one must determine the changes in thermal conductivity during cure as a function of both temperature and the extent of reaction. An apparatus for measurements of thermal conductivity of neat thermosets and their composites was designed and built in our laboratory. A detailed description of the apparatus is given in this paper. Also included are some initial results obtained with an epoxy resin formulation of the type used in filament‐wound structures.
Original language | English (US) |
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Pages (from-to) | 53-56 |
Number of pages | 4 |
Journal | Polymer Composites |
Volume | 8 |
Issue number | 1 |
DOIs | |
State | Published - Feb 1987 |
ASJC Scopus subject areas
- Ceramics and Composites
- General Chemistry
- Polymers and Plastics
- Materials Chemistry