TY - GEN
T1 - An SRAM-based Error-Free Time Domain Pulse Train Computing-In-Memory Macro achieving 226.14 TOPS/W and 5.782 TOPS/mm2
AU - Choi, Edward Jongyoon
AU - Chun, Jiho
AU - Choi, Byeongseon
AU - Ha, Sohmyung
AU - Chang, Ik Joon
AU - Je, Minkyu
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper presents an SRAM-based input bit configurable pulse-train computing-in-memory (CIM) macro for edge devices. The proposed macro computes matrix-vector-multiplications (MVM) in a bit-wise manner, generating pulse trains to overcome the limited signal margin and variations occurring in analog time-domain SRAM-based CIM macros. Furthermore, the system architecture comprises an error-free dynamic OR gate discharge computation, effectively addressing the non-linearity associated with analog computation methods. It also incorporates a dual pulse counter, which enhances the throughput of the system while maintaining high energy efficiency. The prototype 4Kb pulse train SRAM CIM was implemented using 28-nm CMOS technology, achieving 226.14 TOPS/W energy efficiency and a 5.14× increase in area efficiency compared to the state-of-the-art reaching 5.782 TOPS/mm2.
AB - This paper presents an SRAM-based input bit configurable pulse-train computing-in-memory (CIM) macro for edge devices. The proposed macro computes matrix-vector-multiplications (MVM) in a bit-wise manner, generating pulse trains to overcome the limited signal margin and variations occurring in analog time-domain SRAM-based CIM macros. Furthermore, the system architecture comprises an error-free dynamic OR gate discharge computation, effectively addressing the non-linearity associated with analog computation methods. It also incorporates a dual pulse counter, which enhances the throughput of the system while maintaining high energy efficiency. The prototype 4Kb pulse train SRAM CIM was implemented using 28-nm CMOS technology, achieving 226.14 TOPS/W energy efficiency and a 5.14× increase in area efficiency compared to the state-of-the-art reaching 5.782 TOPS/mm2.
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U2 - 10.1109/ISOCC62682.2024.10762599
DO - 10.1109/ISOCC62682.2024.10762599
M3 - Conference contribution
AN - SCOPUS:85213298534
T3 - Proceedings - International SoC Design Conference 2024, ISOCC 2024
SP - 119
EP - 120
BT - Proceedings - International SoC Design Conference 2024, ISOCC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International System-on-Chip Design Conference, ISOCC 2024
Y2 - 19 August 2024 through 22 August 2024
ER -