Analysis and Mapping for Thermal and Energy Efficiency of 3-D Video Processing on 3-D Multicore Processors

Amit Kumar Singh, Muhammad Shafique, Akash Kumar, Jörg Henkel

Research output: Contribution to journalArticlepeer-review


Three-dimensional video processing has high computation requirements and multicore processors realized in 3-D integrated circuits (ICs) provide promising high performance computing platforms. However, the conventional approaches to accelerate the computations involved in 3-D video processing do not exploit the high performance potential of 3-D ICs. In this paper, we propose an application-driven methodology that performs efficient mapping of 3-D video applications' components on 3-D multicores to achieve high performance (throughput). The methodology involves an extensive application analysis to exploit the spatial and temporal correlation available in 3-D neighborhood. Afterward, it leverages the correlation and thermal properties of different 3-D views to perform an efficient mapping of 3-D video processing on cores available at different layers of 3-D IC. The goal is to optimize energy consumption and peak temperature while meeting the throughput requirement. Experiments show 76% reduction in communication energy along with reduction in peak temperature when compared with approaches exploiting architecture characteristics only.

Original languageEnglish (US)
Article number7399408
Pages (from-to)2745-2758
Number of pages14
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Issue number8
StatePublished - Aug 2016


  • 3-D multicore
  • 3-D video
  • design-time analysis
  • interconnect energy
  • synchronous dataflow
  • thermal-aware mapping
  • throughput

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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