TY - GEN
T1 - Bi-axial highly sensitive ±5g polysilicon based differential capacitive accelerometer
AU - Mohammed, Zakriya
AU - Dushaq, Ghada
AU - Chatterjee, Aveek
AU - Rasras, Mahmoud
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/4/29
Y1 - 2016/4/29
N2 - This paper demonstrates the design and simulation of a 2-axis capacitive accelerometer. The design utilizes a simple comb structure to detect capacitance change with a minimum gap spacing of 0.9 μm. By optimizing the design and anti-gap spacing, the device is designed to yield high capacitance change with the proof mass displacement. Initial simulation results show a displacement sensitivity of 0.02μm/g (g=9.8 m/s2) and a differential capacitance sensitivity (scale factor) of 68 fF/g. The sensitivity achieved is best among the devices of its range (± 5g) and dimensions (2×2mm2). This device is being fabricated by GlobalFoundries-Singapore.
AB - This paper demonstrates the design and simulation of a 2-axis capacitive accelerometer. The design utilizes a simple comb structure to detect capacitance change with a minimum gap spacing of 0.9 μm. By optimizing the design and anti-gap spacing, the device is designed to yield high capacitance change with the proof mass displacement. Initial simulation results show a displacement sensitivity of 0.02μm/g (g=9.8 m/s2) and a differential capacitance sensitivity (scale factor) of 68 fF/g. The sensitivity achieved is best among the devices of its range (± 5g) and dimensions (2×2mm2). This device is being fabricated by GlobalFoundries-Singapore.
UR - http://www.scopus.com/inward/record.url?scp=84974555527&partnerID=8YFLogxK
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U2 - 10.1109/EuroSimE.2016.7463335
DO - 10.1109/EuroSimE.2016.7463335
M3 - Conference contribution
AN - SCOPUS:84974555527
T3 - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Y2 - 18 April 2016 through 20 April 2016
ER -