Abstract
Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.
Original language | English (US) |
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Pages (from-to) | 8707-8713 |
Number of pages | 7 |
Journal | Journal of Materials Chemistry C |
Volume | 5 |
Issue number | 34 |
DOIs | |
State | Published - 2017 |
ASJC Scopus subject areas
- General Chemistry
- Materials Chemistry