Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained: Via a controllable in situ SEM-FIB thermal soldering method

Xuan Zhang; Xiujun Zheng; Hong Zhang; Junli Zhang; Jiecai Fu; Qiang Zhang; Chaoyi Peng; Feiming Bai; Xixiang Zhang; Yong Peng

doi:10.1039/c7tc01668a

Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained: Via a controllable in situ SEM-FIB thermal soldering method

Xuan Zhang, Xiujun Zheng, Hong Zhang, Junli Zhang, Jiecai Fu, Qiang Zhang, Chaoyi Peng, Feiming Bai, Xixiang Zhang, Yong Peng

Core Technology Platforms

Research output: Contribution to journal › Article › peer-review

Abstract

Here we demonstrate that the building blocks of semiconductor WO₃ nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

Original language	English (US)
Pages (from-to)	8707-8713
Number of pages	7
Journal	Journal of Materials Chemistry C
Volume	5
Issue number	34
DOIs	https://doi.org/10.1039/c7tc01668a
State	Published - 2017

ASJC Scopus subject areas

Chemistry(all)
Materials Chemistry

Access to Document

10.1039/c7tc01668a

Fingerprint Dive into the research topics of 'Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained: Via a controllable in situ SEM-FIB thermal soldering method'. Together they form a unique fingerprint.

Cite this

Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained : Via a controllable in situ SEM-FIB thermal soldering method. / Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong.

In: Journal of Materials Chemistry C, Vol. 5, No. 34, 2017, p. 8707-8713.

Research output: Contribution to journal › Article › peer-review

@article{50d753393ce1457c941d74e18b5ccb15,

title = "Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained: Via a controllable in situ SEM-FIB thermal soldering method",

abstract = "Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.",

author = "Xuan Zhang and Xiujun Zheng and Hong Zhang and Junli Zhang and Jiecai Fu and Qiang Zhang and Chaoyi Peng and Feiming Bai and Xixiang Zhang and Yong Peng",

year = "2017",

doi = "10.1039/c7tc01668a",

language = "English (US)",

volume = "5",

pages = "8707--8713",

journal = "Journal of Materials Chemistry C",

issn = "2050-7526",

publisher = "Royal Society of Chemistry",

number = "34",

}

TY - JOUR

T1 - Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained

T2 - Via a controllable in situ SEM-FIB thermal soldering method

AU - Zhang, Xuan

AU - Zheng, Xiujun

AU - Zhang, Hong

AU - Zhang, Junli

AU - Fu, Jiecai

AU - Zhang, Qiang

AU - Peng, Chaoyi

AU - Bai, Feiming

AU - Zhang, Xixiang

AU - Peng, Yong

PY - 2017

Y1 - 2017

N2 - Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

AB - Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

UR - http://www.scopus.com/inward/record.url?scp=85028763785&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85028763785&partnerID=8YFLogxK

U2 - 10.1039/c7tc01668a

DO - 10.1039/c7tc01668a

M3 - Article

AN - SCOPUS:85028763785

VL - 5

SP - 8707

EP - 8713

JO - Journal of Materials Chemistry C

JF - Journal of Materials Chemistry C

SN - 2050-7526

IS - 34

ER -