Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained: Via a controllable in situ SEM-FIB thermal soldering method

Xuan Zhang, Xiujun Zheng, Hong Zhang, Junli Zhang, Jiecai Fu, Qiang Zhang, Chaoyi Peng, Feiming Bai, Xixiang Zhang, Yong Peng

Research output: Contribution to journalArticlepeer-review

Abstract

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

Original languageEnglish (US)
Pages (from-to)8707-8713
Number of pages7
JournalJournal of Materials Chemistry C
Volume5
Issue number34
DOIs
StatePublished - 2017

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Chemistry

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