TY - GEN
T1 - Clotho
T2 - 33rd IEEE International Conference on Computer Design, ICCD 2015
AU - Vitkovskiy, Arseniy
AU - Soteriou, Vassos
AU - Gratz, Paul V.
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/12/14
Y1 - 2015/12/14
N2 - With advancing process technology, Chip-Multiprocessors (CMPs) are experiencing ever worsening reliability due to prolonged operational stresses. The network-on-chip that interconnects the components of CMPs is especially vulnerable to such wearout-induced failure. To tackle this ominous threat we present Clotho, a novel, wearout-Aware routing algorithm. Clotho continuously considers the stresses the on-chip interconnect experiences at runtime, along with temperature and fabrication process variation metrics, steering traffic away from locations that are most prone to Electromigration (EM)-and Hot-Carrier Injection (HCI)-induced wear. Under realistic workloads Clotho yields 66% and 8% average increases in mean time to failure for EM and HCI, respectively.
AB - With advancing process technology, Chip-Multiprocessors (CMPs) are experiencing ever worsening reliability due to prolonged operational stresses. The network-on-chip that interconnects the components of CMPs is especially vulnerable to such wearout-induced failure. To tackle this ominous threat we present Clotho, a novel, wearout-Aware routing algorithm. Clotho continuously considers the stresses the on-chip interconnect experiences at runtime, along with temperature and fabrication process variation metrics, steering traffic away from locations that are most prone to Electromigration (EM)-and Hot-Carrier Injection (HCI)-induced wear. Under realistic workloads Clotho yields 66% and 8% average increases in mean time to failure for EM and HCI, respectively.
UR - http://www.scopus.com/inward/record.url?scp=84962422647&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84962422647&partnerID=8YFLogxK
U2 - 10.1109/ICCD.2015.7357092
DO - 10.1109/ICCD.2015.7357092
M3 - Conference contribution
AN - SCOPUS:84962422647
T3 - Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
SP - 117
EP - 124
BT - Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 October 2015 through 21 October 2015
ER -