Comparative Calorimetrie Study of Epoxy Cure by Microwave vs Thermal Energy

Jovan Mijović, Jony Wijaya

Research output: Contribution to journalArticlepeer-review


An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (Tg) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195 °C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields.

Original languageEnglish (US)
Pages (from-to)3671-3674
Number of pages4
Issue number15
StatePublished - 1990

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics
  • Inorganic Chemistry
  • Materials Chemistry


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