Comparative Calorimetrie Study of Epoxy Cure by Microwave vs Thermal Energy

Jovan Mijović; Jony Wijaya

doi:10.1021/ma00217a021

Comparative Calorimetrie Study of Epoxy Cure by Microwave vs Thermal Energy

Jovan Mijović, Jony Wijaya

Chemical and Biomolecular Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (T_g) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195 °C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields.

Original language	English (US)
Pages (from-to)	3671-3674
Number of pages	4
Journal	Macromolecules
Volume	23
Issue number	15
DOIs	https://doi.org/10.1021/ma00217a021
State	Published - 1990

ASJC Scopus subject areas

Organic Chemistry
Polymers and Plastics
Inorganic Chemistry
Materials Chemistry

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10.1021/ma00217a021

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@article{4144c642aad8459a83aeef145f561f58,

title = "Comparative Calorimetrie Study of Epoxy Cure by Microwave vs Thermal Energy",

abstract = "An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (Tg) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195 °C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields.",

author = "Jovan Mijovi{\'c} and Jony Wijaya",

year = "1990",

doi = "10.1021/ma00217a021",

language = "English (US)",

volume = "23",

pages = "3671--3674",

journal = "Macromolecules",

issn = "0024-9297",

publisher = "American Chemical Society",

number = "15",

}

TY - JOUR

T1 - Comparative Calorimetrie Study of Epoxy Cure by Microwave vs Thermal Energy

AU - Mijović, Jovan

AU - Wijaya, Jony

PY - 1990

Y1 - 1990

N2 - An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (Tg) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195 °C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields.

AB - An investigation was carried out into the kinetics of cure of an epoxy formulation by microwave versus thermal energy. The formulation consisted of a diglycidyl ether of bisphenol A (DGEBA) type epoxy resin and diaminodiphenyl sulfone (DDS) curing agent. Differential scanning calorimetry (DSC) was used to measure and compare the degree of cure (α) and the glass transition (Tg) of samples cured at the same temperature in microwave and thermal fields. A description of the microwave circuit is given. It was found that in the temperature interval used in this study (155-195 °C), cure proceeded slightly faster in thermal than in microwave field. Also, a broader glass transition range was observed in microwave-cured samples, suggesting a possible difference in the mechanism of cure in thermal and microwave fields.

UR - http://www.scopus.com/inward/record.url?scp=0025465079&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025465079&partnerID=8YFLogxK

U2 - 10.1021/ma00217a021

DO - 10.1021/ma00217a021

M3 - Article

AN - SCOPUS:0025465079

SN - 0024-9297

VL - 23

SP - 3671

EP - 3674

JO - Macromolecules

JF - Macromolecules

IS - 15

ER -

Comparative Calorimetrie Study of Epoxy Cure by Microwave vs Thermal Energy

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