Correlation between dielectric and chemorheological properties during cure of epoxy-based composites

A. Maffezzoli; A. Trivisano; M. Opalicki; J. Mijovic; J. M. Kenny

doi:10.1007/BF00445996

Correlation between dielectric and chemorheological properties during cure of epoxy-based composites

A. Maffezzoli, A. Trivisano, M. Opalicki, J. Mijovic, J. M. Kenny

Chemical and Biomolecular Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

A method for the complete thermal, rheological and dielectric characterization of an epoxy matrix for advanced composites is presented. The analysis of the dielectric response suggests that ionic resistivity data can be used to develop quantitative correlations with the materials properties during thermosets processing. Ionic resistivity and degree of reaction data are correlated during the cure of the studied epoxy matrix and good agreement between the model predictions and the experimental data is observed under isothermal and non-isothermal conditions. Moreover, degree of reaction data calculated from dielectric measurements are used in a chemorheological model for viscosity calculation, obtaining very good correlation between measured and predicted viscosity.

Original language	English (US)
Pages (from-to)	800-808
Number of pages	9
Journal	Journal of Materials Science
Volume	29
Issue number	3
DOIs	https://doi.org/10.1007/BF00445996
State	Published - Jan 1994

ASJC Scopus subject areas

General Materials Science
Mechanics of Materials
Mechanical Engineering

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10.1007/BF00445996

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@article{2f8e1032099444909e0408b272188c24,

title = "Correlation between dielectric and chemorheological properties during cure of epoxy-based composites",

abstract = "A method for the complete thermal, rheological and dielectric characterization of an epoxy matrix for advanced composites is presented. The analysis of the dielectric response suggests that ionic resistivity data can be used to develop quantitative correlations with the materials properties during thermosets processing. Ionic resistivity and degree of reaction data are correlated during the cure of the studied epoxy matrix and good agreement between the model predictions and the experimental data is observed under isothermal and non-isothermal conditions. Moreover, degree of reaction data calculated from dielectric measurements are used in a chemorheological model for viscosity calculation, obtaining very good correlation between measured and predicted viscosity.",

author = "A. Maffezzoli and A. Trivisano and M. Opalicki and J. Mijovic and Kenny, {J. M.}",

year = "1994",

month = jan,

doi = "10.1007/BF00445996",

language = "English (US)",

volume = "29",

pages = "800--808",

journal = "Journal of Materials Science",

issn = "0022-2461",

publisher = "Springer",

number = "3",

}

TY - JOUR

T1 - Correlation between dielectric and chemorheological properties during cure of epoxy-based composites

AU - Maffezzoli, A.

AU - Trivisano, A.

AU - Opalicki, M.

AU - Mijovic, J.

AU - Kenny, J. M.

PY - 1994/1

Y1 - 1994/1

N2 - A method for the complete thermal, rheological and dielectric characterization of an epoxy matrix for advanced composites is presented. The analysis of the dielectric response suggests that ionic resistivity data can be used to develop quantitative correlations with the materials properties during thermosets processing. Ionic resistivity and degree of reaction data are correlated during the cure of the studied epoxy matrix and good agreement between the model predictions and the experimental data is observed under isothermal and non-isothermal conditions. Moreover, degree of reaction data calculated from dielectric measurements are used in a chemorheological model for viscosity calculation, obtaining very good correlation between measured and predicted viscosity.

AB - A method for the complete thermal, rheological and dielectric characterization of an epoxy matrix for advanced composites is presented. The analysis of the dielectric response suggests that ionic resistivity data can be used to develop quantitative correlations with the materials properties during thermosets processing. Ionic resistivity and degree of reaction data are correlated during the cure of the studied epoxy matrix and good agreement between the model predictions and the experimental data is observed under isothermal and non-isothermal conditions. Moreover, degree of reaction data calculated from dielectric measurements are used in a chemorheological model for viscosity calculation, obtaining very good correlation between measured and predicted viscosity.

UR - http://www.scopus.com/inward/record.url?scp=0028378083&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028378083&partnerID=8YFLogxK

U2 - 10.1007/BF00445996

DO - 10.1007/BF00445996

M3 - Article

AN - SCOPUS:0028378083

SN - 0022-2461

VL - 29

SP - 800

EP - 808

JO - Journal of Materials Science

JF - Journal of Materials Science

IS - 3

ER -

Correlation between dielectric and chemorheological properties during cure of epoxy-based composites

Abstract

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