Cure kinetics of epoxy resins and aromatic diamines

Antonio Moroni; Jovan Mijovic; Eli M. Pearce; Cheu Ching Foun

doi:10.1002/app.1986.070320231

Cure kinetics of epoxy resins and aromatic diamines

Antonio Moroni, Jovan Mijovic, Eli M. Pearce, Cheu Ching Foun

Chemical and Biomolecular Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

An analysis of the cure kinetics of several different formulations composed of bifunctional epoxy resins and aromatic diamines was performed. A series of isothermal differential scanning calorimetry (DSC) runs (at higher temperature) and Fourier transform infrared spectroscopy (FT‐IR) runs (at lower temperature) provided information about the kinetics of cure in the temperature range 18–160°C. All kinetic parameters of the curing reaction, including the reaction rate order, activation energy, and frequency factor were calculated and reported. Dynamic and isothermal DSC yielded different results. An explanation was offered in terms of different curing mechanisms which prevail under different curing conditions. A mechanism scheme was proposed to account for various possible reactions during cure.

Original language	English (US)
Pages (from-to)	3761-3773
Number of pages	13
Journal	Journal of Applied Polymer Science
Volume	32
Issue number	2
DOIs	https://doi.org/10.1002/app.1986.070320231
State	Published - Aug 5 1986

ASJC Scopus subject areas

General Chemistry
Surfaces, Coatings and Films
Polymers and Plastics
Materials Chemistry

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10.1002/app.1986.070320231

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title = "Cure kinetics of epoxy resins and aromatic diamines",

abstract = "An analysis of the cure kinetics of several different formulations composed of bifunctional epoxy resins and aromatic diamines was performed. A series of isothermal differential scanning calorimetry (DSC) runs (at higher temperature) and Fourier transform infrared spectroscopy (FT‐IR) runs (at lower temperature) provided information about the kinetics of cure in the temperature range 18–160°C. All kinetic parameters of the curing reaction, including the reaction rate order, activation energy, and frequency factor were calculated and reported. Dynamic and isothermal DSC yielded different results. An explanation was offered in terms of different curing mechanisms which prevail under different curing conditions. A mechanism scheme was proposed to account for various possible reactions during cure.",

author = "Antonio Moroni and Jovan Mijovic and Pearce, {Eli M.} and Foun, {Cheu Ching}",

year = "1986",

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AU - Moroni, Antonio

AU - Mijovic, Jovan

AU - Pearce, Eli M.

AU - Foun, Cheu Ching

PY - 1986/8/5

Y1 - 1986/8/5

N2 - An analysis of the cure kinetics of several different formulations composed of bifunctional epoxy resins and aromatic diamines was performed. A series of isothermal differential scanning calorimetry (DSC) runs (at higher temperature) and Fourier transform infrared spectroscopy (FT‐IR) runs (at lower temperature) provided information about the kinetics of cure in the temperature range 18–160°C. All kinetic parameters of the curing reaction, including the reaction rate order, activation energy, and frequency factor were calculated and reported. Dynamic and isothermal DSC yielded different results. An explanation was offered in terms of different curing mechanisms which prevail under different curing conditions. A mechanism scheme was proposed to account for various possible reactions during cure.

AB - An analysis of the cure kinetics of several different formulations composed of bifunctional epoxy resins and aromatic diamines was performed. A series of isothermal differential scanning calorimetry (DSC) runs (at higher temperature) and Fourier transform infrared spectroscopy (FT‐IR) runs (at lower temperature) provided information about the kinetics of cure in the temperature range 18–160°C. All kinetic parameters of the curing reaction, including the reaction rate order, activation energy, and frequency factor were calculated and reported. Dynamic and isothermal DSC yielded different results. An explanation was offered in terms of different curing mechanisms which prevail under different curing conditions. A mechanism scheme was proposed to account for various possible reactions during cure.

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Cure kinetics of epoxy resins and aromatic diamines

Abstract

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