TY - GEN
T1 - Design of high-performance, power-efficient optical NoCs using Silica-embedded silicon nanophotonics
AU - Kakoulli, Elena
AU - Soteriou, Vassos
AU - Koutsides, Charalambos
AU - Kalli, Kyriacos
PY - 2015/12/14
Y1 - 2015/12/14
N2 - With on-chip electrical interconnects being marred by high energy-To-bandwidth costs, threatening multicore scalability, on-chip nanophotonics, which offer high throughput, yet energy-efficient communication, form an alternative attractive counterpart. In this paper we consider silicon nanophotonic components that are embedded completely within the silica (SiO2) substrate as opposed to prior-Art that utilizes die on-surface silicon nanophotonics. As nanophotonic components now reside in the silica substrate's subsurface non-obstructive interconnect geometries offering higher network throughput can be implemented. First, we show using detailed simulations based on commercial optical tools that such Silicon-In-Silica (SiS) structures are feasible, derive their geometry characteristics and design parameters, and then demonstrate our proof of concept by utilizing a hybrid SiS-based photonic mesh-diagonal links network-on-chip topology. In pushing the performance envelope even more, we next develop (1) an associated contention-Aware photonic adaptive routing function, and (2) a parallelized photonic channel allocation scheme, that in tandem further reduce message delivery latency. An extensive experimental evaluation, including utilizing traffic benchmarks gathered from full-system chip multiprocessor simulations, shows that our methodology boosts network throughput by up to 30.8%, reduces communication latency by up to 22.5%, and improves the throughput-To-power ratio by up to 23.7% when compared to prior-Art.
AB - With on-chip electrical interconnects being marred by high energy-To-bandwidth costs, threatening multicore scalability, on-chip nanophotonics, which offer high throughput, yet energy-efficient communication, form an alternative attractive counterpart. In this paper we consider silicon nanophotonic components that are embedded completely within the silica (SiO2) substrate as opposed to prior-Art that utilizes die on-surface silicon nanophotonics. As nanophotonic components now reside in the silica substrate's subsurface non-obstructive interconnect geometries offering higher network throughput can be implemented. First, we show using detailed simulations based on commercial optical tools that such Silicon-In-Silica (SiS) structures are feasible, derive their geometry characteristics and design parameters, and then demonstrate our proof of concept by utilizing a hybrid SiS-based photonic mesh-diagonal links network-on-chip topology. In pushing the performance envelope even more, we next develop (1) an associated contention-Aware photonic adaptive routing function, and (2) a parallelized photonic channel allocation scheme, that in tandem further reduce message delivery latency. An extensive experimental evaluation, including utilizing traffic benchmarks gathered from full-system chip multiprocessor simulations, shows that our methodology boosts network throughput by up to 30.8%, reduces communication latency by up to 22.5%, and improves the throughput-To-power ratio by up to 23.7% when compared to prior-Art.
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U2 - 10.1109/ICCD.2015.7357077
DO - 10.1109/ICCD.2015.7357077
M3 - Conference contribution
AN - SCOPUS:84962339449
T3 - Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
SP - 1
EP - 8
BT - Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Computer Design, ICCD 2015
Y2 - 18 October 2015 through 21 October 2015
ER -