Designing high-performance, power-efficient NoCs with embedded silicon-in-silica nanophotonics

Elena Kakoulli, Vassos Soteriou, Charalambos Koutsides, Kyriacos Kalli

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

On-chip electrical links exhibit large energy-to-bandwidth costs, whereas on-chip nanophotonics, which attain high throughput, yet energy-efficient communication, have emerged as an alternative interconnect in multicore chips. Here we consider silicon nanophotonic components that are embedded completely within the silica (SiO2) substrate as opposed to existing die on-surface silicon nanophotonics. As nanophotonic components now reside subsurface, within the silica substrate, non-obstructive interconnect geometries offering higher network throughput can be implemented. First, we show using detailed simulations based on commercial tools that such Silicon-in-Silica (SiS) structures are feasible, and then demonstrate our proof of concept by utilizing a SiS-based mesh-interconnected topology with augmented diagonal optical channels that provides both higher effective throughput and throughput-to-power ratio versus prior-art. Copyright is held by the owner/author(s).

Original languageEnglish (US)
Title of host publicationProceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015
EditorsDiana Marculescu, Andre Ivanov, Partha Pratim Pande, Jose Flich
PublisherAssociation for Computing Machinery, Inc
ISBN (Electronic)9781450333962
DOIs
StatePublished - Sep 28 2015
Event9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015 - Vancouver, Canada
Duration: Sep 28 2015Sep 30 2015

Publication series

NameProceedings - 2015 9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015

Other

Other9th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2015
CountryCanada
CityVancouver
Period9/28/159/30/15

Keywords

  • On-chip nanophotonics
  • Silicon-in-silica
  • Topology

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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