DNA assembly of component arrays for nanoscale electronics

Richard A. Kiehl; John D. Le; Karin Musier-Forsyth; Yariv Y. Pinto; Nadrian C. Seeman; T. Andrew Taton

doi:10.1109/NANO.2005.1500636

DNA assembly of component arrays for nanoscale electronics

Richard A. Kiehl, John D. Le, Karin Musier-Forsyth, Yariv Y. Pinto, Nadrian C. Seeman, T. Andrew Taton

Chemistry

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

Original language	English (US)
Title of host publication	2005 5th IEEE Conference on Nanotechnology
Publisher	IEEE Computer Society
Pages	738-741
Number of pages	4
ISBN (Print)	0780391993, 9780780391994
DOIs	https://doi.org/10.1109/NANO.2005.1500636
State	Published - 2005
Event	2005 5th IEEE Conference on Nanotechnology - Nagoya, Japan Duration: Jul 11 2005 → Jul 15 2005

Publication series

Name	2005 5th IEEE Conference on Nanotechnology
Volume	2

Other

Other	2005 5th IEEE Conference on Nanotechnology
Country/Territory	Japan
City	Nagoya
Period	7/11/05 → 7/15/05

Keywords

Integrated circuit fabrication
Molecular electronics
Nanotechnology

ASJC Scopus subject areas

General Engineering

Access to Document

10.1109/NANO.2005.1500636

Cite this

Kiehl, RA, Le, JD, Musier-Forsyth, K, Pinto, YY, Seeman, NC & Andrew Taton, T 2005, DNA assembly of component arrays for nanoscale electronics. in 2005 5th IEEE Conference on Nanotechnology., 1500636, 2005 5th IEEE Conference on Nanotechnology, vol. 2, IEEE Computer Society, pp. 738-741, 2005 5th IEEE Conference on Nanotechnology, Nagoya, Japan, 7/11/05. https://doi.org/10.1109/NANO.2005.1500636

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title = "DNA assembly of component arrays for nanoscale electronics",

abstract = "A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.",

keywords = "Integrated circuit fabrication, Molecular electronics, Nanotechnology",

author = "Kiehl, {Richard A.} and Le, {John D.} and Karin Musier-Forsyth and Pinto, {Yariv Y.} and Seeman, {Nadrian C.} and {Andrew Taton}, T.",

year = "2005",

doi = "10.1109/NANO.2005.1500636",

language = "English (US)",

isbn = "0780391993",

series = "2005 5th IEEE Conference on Nanotechnology",

publisher = "IEEE Computer Society",

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note = "2005 5th IEEE Conference on Nanotechnology ; Conference date: 11-07-2005 Through 15-07-2005",

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T1 - DNA assembly of component arrays for nanoscale electronics

AU - Kiehl, Richard A.

AU - Le, John D.

AU - Musier-Forsyth, Karin

AU - Pinto, Yariv Y.

AU - Seeman, Nadrian C.

AU - Andrew Taton, T.

PY - 2005

Y1 - 2005

N2 - A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

AB - A method for assembling arrays of components in programmable 2D arrangements with nanometer-scale precision is needed for the manufacture of high density nanoelectronic circuitry. We discuss programmed self-assembly based on in situ hybridization of DNA-functionalized components to a pre-assembled 2D DNA scaffolding on a surface. We show that arrays of prototype electronic components composed of Au nanoparticles and nanowires can be assembled on a surface with high precision. This approach is broadly applicable to the manufacture of nanoscale integrated circuits for logic, memory, sensing, and other applications.

KW - Integrated circuit fabrication

KW - Molecular electronics

KW - Nanotechnology

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U2 - 10.1109/NANO.2005.1500636

DO - 10.1109/NANO.2005.1500636

M3 - Conference contribution

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SN - 0780391993

SN - 9780780391994

T3 - 2005 5th IEEE Conference on Nanotechnology

SP - 738

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BT - 2005 5th IEEE Conference on Nanotechnology

PB - IEEE Computer Society

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ER -

DNA assembly of component arrays for nanoscale electronics

Abstract

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Keywords

ASJC Scopus subject areas

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