TY - GEN
T1 - FPGA-Patch
T2 - 2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023
AU - Ahmadi, Mahya Morid
AU - Alrahis, Lilas
AU - Sinanoglu, Ozgur
AU - Shafique, Muhammad
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - We propose FPGA-Patch, the first-of-its-kind defense that leverages automated program repair concepts to thwart power side-channel attacks on cloud FPGAs. FPGA-Patch generates isofunctional variants of the target hardware by injecting faults and finding transformations that eliminate failure. The obtained variants display different hardware characteristics, ensuring a maximal diversity in power traces once dynamically swapped at run-time. Yet, FPGA-Patch forces the variants to have enough similarity, enabling bitstream compression and minimizing dynamic exchange costs. Considering AES running on AMD/Xilinx FPGA, FPGA-Patch increases the attacker's effort by three orders of magnitude, while preserving the performance of AES and a minimal area overhead of 14.2%.
AB - We propose FPGA-Patch, the first-of-its-kind defense that leverages automated program repair concepts to thwart power side-channel attacks on cloud FPGAs. FPGA-Patch generates isofunctional variants of the target hardware by injecting faults and finding transformations that eliminate failure. The obtained variants display different hardware characteristics, ensuring a maximal diversity in power traces once dynamically swapped at run-time. Yet, FPGA-Patch forces the variants to have enough similarity, enabling bitstream compression and minimizing dynamic exchange costs. Considering AES running on AMD/Xilinx FPGA, FPGA-Patch increases the attacker's effort by three orders of magnitude, while preserving the performance of AES and a minimal area overhead of 14.2%.
UR - http://www.scopus.com/inward/record.url?scp=85171622171&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85171622171&partnerID=8YFLogxK
U2 - 10.1109/ISLPED58423.2023.10244526
DO - 10.1109/ISLPED58423.2023.10244526
M3 - Conference contribution
AN - SCOPUS:85171622171
T3 - Proceedings of the International Symposium on Low Power Electronics and Design
BT - 2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 7 August 2023 through 8 August 2023
ER -