Full-Stack End-to-End mmWave Simulations Using 3GPP and NYUSIM Channel Model in ns-3

Hitesh Poddar, Tomoki Yoshimura, Matteo Pagin, Theodore S. Rappaport, Art Ishii, Michele Zorzi

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Accurate channel modeling and simulation tools are vital for studying sub-THz and millimeter (mmWave) wideband communication system performance. To accurately design future high data rate, low latency wireless modems, the entire protocol stack must be appropriately modeled to understand how the physical layer impacts the end-to-end performance experienced by the end user. This paper presents a full stack end-to-end performance analysis in ns-3 using drop-based NYU channel model (NYUSIM) and 3GPP statistical channel model (SCM) in scenarios, namely urban microcell (UMi), urban macrocell (UMa), rural macrocell (RMa), and indoor hotspot (InH) at 28 GHz with 100 MHz bandwidth. Video data is transmitted at 50 Mbps using User Datagram Protocol (UDP), and we observe that the RMa channel is benign in non-line of sight (NLOS) for NYUSIM and 3GPP SCM as it exhibits no packet drops and yields maximum throughput (48.1 Mbps) and latency of ∼ 20 ms. In NLOS, for NYUSIM, the UMa and RMa channels are similar in terms of throughput and packet drops, and the latency in UMi and InH scenarios is 10 times and 25 times higher respectively compared to UMa. Our results indicate that mmWave bands can support data rates of 50 Mbps with negligible packet drops and latency below 150 ms in all scenarios using NYUSIM.

Original languageEnglish (US)
Title of host publicationICC 2023 - IEEE International Conference on Communications
Subtitle of host publicationSustainable Communications for Renaissance
EditorsMichele Zorzi, Meixia Tao, Walid Saad
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Electronic)9781538674628
StatePublished - 2023
Event2023 IEEE International Conference on Communications, ICC 2023 - Rome, Italy
Duration: May 28 2023Jun 1 2023

Publication series

NameIEEE International Conference on Communications
ISSN (Print)1550-3607


Conference2023 IEEE International Conference on Communications, ICC 2023


  • 5G
  • 6G
  • Latency
  • packet drop
  • throughput

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering


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