Generation of Spatially-Variant Anisotropic Metamaterials in 3D Volumetric Circuits

Asad U.H. Gulib, Jeremie Dumas, Cesar L. Valle, Edgar Bustamante, Daniele Panozzo, Raymond C. Rumpf

Research output: Contribution to journalArticlepeer-review

Abstract

3D printing is revolutionizing manufacturing and is now being considered in the electronics industry. The creation of the first 3D volumetric circuit (3DVC) has created a way to make circuits smaller, lighter, into unconventional form factors and exploit physics like anisotropy more effectively than planar geometries can. While this is exciting, many problems must be solved to make 3DVCs a reality. One of these problems is electromagnetic interference and mutual coupling between components that are expected to be highly problematic in high frequency 3DVCs. Spatially-variant anisotropic metamaterials (SVAMs) could be a solution to overcome this difficulty, but research in this area is not possible without a way to generate SVAMs around multiple components. In this paper, an algorithm is integrated into CAD software that can generate SVAMs for 3D circuits which will enable future studies of SVAMs.

Original languageEnglish (US)
Pages (from-to)93-102
Number of pages10
JournalProgress In Electromagnetics Research C
Volume134
DOIs
StatePublished - 2023

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Fingerprint

Dive into the research topics of 'Generation of Spatially-Variant Anisotropic Metamaterials in 3D Volumetric Circuits'. Together they form a unique fingerprint.

Cite this