TY - GEN
T1 - Hierarchical power budgeting for Dark Silicon chips
AU - Khan, Muhammad Usman Karim
AU - Shafique, Muhammad
AU - Henkel, Jörg
N1 - Publisher Copyright:
© 2015 IEEE.
Copyright:
Copyright 2016 Elsevier B.V., All rights reserved.
PY - 2015/9/21
Y1 - 2015/9/21
N2 - The emerging Dark Silicon limitation has led the application designers to carefully consider the available Thermal Design Power (TDP) budgets, hardware resources, and software characteristics. In this paper, we propose a hierarchical scheme for distributing the resources and TDP budget among concurrently executing applications with multi-threaded workloads under throughput constraints. Afterwards, the application-level TDP budget is partitioned among its threads depending upon their workloads, which can then be fine-tuned at run time considering workload variations. We evaluate our scheme for the next-generation, multi-threaded, High Efficiency Video Codec and demonstrate that up to 30.86% higher throughput is achieved compared to the state-of-the-art.
AB - The emerging Dark Silicon limitation has led the application designers to carefully consider the available Thermal Design Power (TDP) budgets, hardware resources, and software characteristics. In this paper, we propose a hierarchical scheme for distributing the resources and TDP budget among concurrently executing applications with multi-threaded workloads under throughput constraints. Afterwards, the application-level TDP budget is partitioned among its threads depending upon their workloads, which can then be fine-tuned at run time considering workload variations. We evaluate our scheme for the next-generation, multi-threaded, High Efficiency Video Codec and demonstrate that up to 30.86% higher throughput is achieved compared to the state-of-the-art.
KW - dark silicon
KW - many-core system
KW - parallel HEVC
KW - power budgeting
KW - resource allocation
KW - Thermal design power
UR - http://www.scopus.com/inward/record.url?scp=84958522634&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84958522634&partnerID=8YFLogxK
U2 - 10.1109/ISLPED.2015.7273516
DO - 10.1109/ISLPED.2015.7273516
M3 - Conference contribution
AN - SCOPUS:84958522634
T3 - Proceedings of the International Symposium on Low Power Electronics and Design
SP - 213
EP - 218
BT - Proceedings of the International Symposium on Low Power Electronics and Design, ISLPED 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2015
Y2 - 22 July 2015 through 24 July 2015
ER -