TY - JOUR
T1 - Hybrid scratchpad video memory architecture for energy-efficient parallel hevc
AU - Sampaio, Felipe M.
AU - Zatt, Bruno
AU - Shafique, Muhammad
AU - Henkel, Jorg
AU - Bampi, Sergio
N1 - Funding Information:
Manuscript received February 8, 2018; revised April 29, 2018, June 6, 2018, and July 17, 2018; accepted September 3, 2018. Date of publication September 17, 2018; date of current version October 2, 2019. This research was partially funding by National Council for Scientific and Technological Development (CNPq) of Brazil. This paper was recommended by Associate Editor Y. Zhang. (Corresponding author: Felipe M. Sampaio.) F. M. Sampaio and S. Bampi are with PPGC, Informatics Institute, Federal University of Rio Grande do Sul, Porto Alegre 90650-001, Brazil (e-mail: [email protected]; [email protected]). B. Zatt is with the Center of Technology Development, Federal University of Pelotas, Pelotas 96010-610, Brazil (e-mail: [email protected]). M. Shafique is with the Institute of Computer Engineering, Vienna University of Technology, 1040 Wien, Austria (e-mail: muhammad. [email protected]). J. Henkel is with the Chair for Embedded Systems, Karlsruhe Institute of Technology, 76131 Karlsruhe, Germany (e-mail: [email protected]). Color versions of one or more of the figures in this article are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/TCSVT.2018.2870825
Publisher Copyright:
© 1991-2012 IEEE.
Copyright:
Copyright 2019 Elsevier B.V., All rights reserved.
PY - 2019/10
Y1 - 2019/10
N2 - A hybrid scratchpad video memory (Hy-SVM) for energy-efficient tiles-parallelized high-efficiency video coding (HEVC) is presented here. The key ideas behind the Hy-SVM include: Application-specific design and management; combined multiple levels of private and shared memories that jointly exploit intra-Tile and inter-Tiles data reuse; scratchpad memories (SPMs) as on-chip data storage; SRAM; and STT-RAM hybrid design. We propose a design methodology for the Hy-SVM that leverages application-specific properties to properly define the SPMs parameters. The inter-Tiles data reuse potential of parallel HEVC is exploited by our run-Time overlap prediction scheme, which identifies the redundant memory access behavior by analyzing monitored past frames encoding. Based on the predicted overlap characteristics, the Hy-SVM integrates memory access management units to control the access dynamics to the private/shared SPM levels. Furthermore, adaptive access management units (APMUs) can strongly reduce on-chip energy consumption due to the predicted overlap formation. The experimental results demonstrate the Hy-SVM overall energy savings of 11%-64% (4-Tile) and 8%-46% (8-Tile) when compared with related works. From the external memory perspective, the Hy-SVM can improve data reuse, resulting in 14%-59% of off-chip energy consumption (compared with no inter-Tiles data reuse scenarios). In addition, our APMU contributes by reducing on-chip energy consumption of the Hy-SVM by 58%, on average. Thus, compared with related works, the Hy-SVM presents the lowest on-chip energy consumption. Moreover, the overhead of implementing our management units insignificantly affects the performance-and energy-efficiency of the Hy-SVM.
AB - A hybrid scratchpad video memory (Hy-SVM) for energy-efficient tiles-parallelized high-efficiency video coding (HEVC) is presented here. The key ideas behind the Hy-SVM include: Application-specific design and management; combined multiple levels of private and shared memories that jointly exploit intra-Tile and inter-Tiles data reuse; scratchpad memories (SPMs) as on-chip data storage; SRAM; and STT-RAM hybrid design. We propose a design methodology for the Hy-SVM that leverages application-specific properties to properly define the SPMs parameters. The inter-Tiles data reuse potential of parallel HEVC is exploited by our run-Time overlap prediction scheme, which identifies the redundant memory access behavior by analyzing monitored past frames encoding. Based on the predicted overlap characteristics, the Hy-SVM integrates memory access management units to control the access dynamics to the private/shared SPM levels. Furthermore, adaptive access management units (APMUs) can strongly reduce on-chip energy consumption due to the predicted overlap formation. The experimental results demonstrate the Hy-SVM overall energy savings of 11%-64% (4-Tile) and 8%-46% (8-Tile) when compared with related works. From the external memory perspective, the Hy-SVM can improve data reuse, resulting in 14%-59% of off-chip energy consumption (compared with no inter-Tiles data reuse scenarios). In addition, our APMU contributes by reducing on-chip energy consumption of the Hy-SVM by 58%, on average. Thus, compared with related works, the Hy-SVM presents the lowest on-chip energy consumption. Moreover, the overhead of implementing our management units insignificantly affects the performance-and energy-efficiency of the Hy-SVM.
KW - adaptivity
KW - application-specific optimization
KW - energy efficiency
KW - HEVC
KW - scratchpad
KW - Video memory
UR - http://www.scopus.com/inward/record.url?scp=85053337421&partnerID=8YFLogxK
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U2 - 10.1109/TCSVT.2018.2870825
DO - 10.1109/TCSVT.2018.2870825
M3 - Article
AN - SCOPUS:85053337421
SN - 1051-8215
VL - 29
SP - 3046
EP - 3060
JO - IEEE Transactions on Circuits and Systems for Video Technology
JF - IEEE Transactions on Circuits and Systems for Video Technology
IS - 10
M1 - 8466911
ER -