TY - GEN
T1 - Improved sensitivity of ionic liquid-based pressure sensor for body-on-a-chip using simulation-based 3D lithography
AU - Hirai, Yoshikazu
AU - Tsuji, Yusuke
AU - Kamei, Ken Ichiro
AU - Tsuchiya, Toshiyuki
AU - Tabata, Osamu
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - This paper presents the novel fabrication of highly sensitive ionic liquid-based pressure sensor integrated in a poly(dimethylsiloxane) microfluidic device. The proposed fabrication method provides an ability to simultaneous fabrication of the pressure sensor and microfluidic components by multilayer soft lithography. To improve the sensitivity in a low-pressure range, sensor structure and electrical output are investigated by a numerical simulation. Then the analyzed sensor structure is precisely fabricated by three-dimensional (3D) lithography utilizing a numerical process optimization. Both numerical and experimental results revealed the sensor output depends on a cross section geometry of ionic liquid-filled channel, and confirmed the improved sensitivity.
AB - This paper presents the novel fabrication of highly sensitive ionic liquid-based pressure sensor integrated in a poly(dimethylsiloxane) microfluidic device. The proposed fabrication method provides an ability to simultaneous fabrication of the pressure sensor and microfluidic components by multilayer soft lithography. To improve the sensitivity in a low-pressure range, sensor structure and electrical output are investigated by a numerical simulation. Then the analyzed sensor structure is precisely fabricated by three-dimensional (3D) lithography utilizing a numerical process optimization. Both numerical and experimental results revealed the sensor output depends on a cross section geometry of ionic liquid-filled channel, and confirmed the improved sensitivity.
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U2 - 10.1109/MEMSYS.2018.8346602
DO - 10.1109/MEMSYS.2018.8346602
M3 - Conference contribution
AN - SCOPUS:85046999853
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 511
EP - 514
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -