Increasing of thermal stability of solar absorbers soldered by low temperature solders

Igor Pashkov, Alexey Pashkov, Oksana Kustova, Denis Zorin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

One of the important properties of heat absorbers is thermal stability up to 250-270°C during short time heating without water. There is some contradiction with the requirement of use for low tin based solders for absorber foil brazing. The combined brazing of frame with copper-phosphorus brazing alloy and further soldering with 97Sn3Cu or 99Sn1Cu alloys is described in this work. Metallographic analysis and micro X-ray analysis were carried out on copper sheet - brass tube samples. To increase thermal stability the joint formation in different conditions of gap and time - temperature relations was investigated. Optimal conditions allowed base metal dissolution and creation of solid phase boundaries between copper and brass parts.

Original languageEnglish (US)
Title of host publicationIBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference
Pages63-66
Number of pages4
StatePublished - 2012
Event5th International Brazing and Soldering Conference, IBSC 2012 - Las Vegas, NV, United States
Duration: Apr 22 2012Apr 25 2012

Publication series

NameIBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference

Conference

Conference5th International Brazing and Soldering Conference, IBSC 2012
CountryUnited States
CityLas Vegas, NV
Period4/22/124/25/12

ASJC Scopus subject areas

  • Chemical Engineering (miscellaneous)

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    Pashkov, I., Pashkov, A., Kustova, O., & Zorin, D. (2012). Increasing of thermal stability of solar absorbers soldered by low temperature solders. In IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference (pp. 63-66). (IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference).