Innovative engineering outreach using Intel® security and embedded tools

Raghudeep Kannavara; Patrick Schaumont; Michail Maniatakos; Michael A. Smith; Scott Buck

doi:10.1109/EWME.2014.6877411

Innovative engineering outreach using Intel^® security and embedded tools

Raghudeep Kannavara, Patrick Schaumont, Michail Maniatakos, Michael A. Smith, Scott Buck

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

During Spring 2013, the Evaluation Platforms Program from Intel and the Intel Software and Services Group donated Intel^® Atom™ processor based development kits to the Electrical and Computer Engineering (ECE) Departments at Virginia Tech University and Polytechnic Institute of New York University (NYU Poly). The goal was to enable engineering faculty to develop projects based on Intel^® security and embedded tools. The projects thus developed, key learnings and project outcomes are elucidated in this paper. Further, we evaluate the outreach projects to highlight the two different, yet important approaches to security curriculum development emphasizing security engineering versus security attacks.

Original language	English (US)
Title of host publication	10th European Workshop on Microelectronics Education, EWME 2014
Publisher	IEEE Computer Society
Pages	127-132
Number of pages	6
ISBN (Print)	9781479940165
DOIs	https://doi.org/10.1109/EWME.2014.6877411
State	Published - 2014
Event	10th European Workshop on Microelectronics Education, EWME 2014 - Tallinn, Estonia Duration: May 14 2014 → May 16 2014

Publication series

Name	10th European Workshop on Microelectronics Education, EWME 2014

Other

Other	10th European Workshop on Microelectronics Education, EWME 2014
Country/Territory	Estonia
City	Tallinn
Period	5/14/14 → 5/16/14

Keywords

Computer Security
Embedded Platforms
Engineering Outreach

ASJC Scopus subject areas

Electrical and Electronic Engineering
Education

Access to Document

10.1109/EWME.2014.6877411

Cite this

Kannavara, R., Schaumont, P., Maniatakos, M., Smith, M. A., & Buck, S. (2014). Innovative engineering outreach using Intel^® security and embedded tools. In 10th European Workshop on Microelectronics Education, EWME 2014 (pp. 127-132). Article 6877411 (10th European Workshop on Microelectronics Education, EWME 2014). IEEE Computer Society. https://doi.org/10.1109/EWME.2014.6877411

Innovative engineering outreach using Intel^® security and embedded tools. / Kannavara, Raghudeep; Schaumont, Patrick; Maniatakos, Michail et al.
10th European Workshop on Microelectronics Education, EWME 2014. IEEE Computer Society, 2014. p. 127-132 6877411 (10th European Workshop on Microelectronics Education, EWME 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kannavara, R, Schaumont, P, Maniatakos, M, Smith, MA & Buck, S 2014, Innovative engineering outreach using Intel^® security and embedded tools. in 10th European Workshop on Microelectronics Education, EWME 2014., 6877411, 10th European Workshop on Microelectronics Education, EWME 2014, IEEE Computer Society, pp. 127-132, 10th European Workshop on Microelectronics Education, EWME 2014, Tallinn, Estonia, 5/14/14. https://doi.org/10.1109/EWME.2014.6877411

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