TY - GEN
T1 - Inspiring trust in outsourced integrated circuit fabrication
AU - Garg, Siddharth
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/5/11
Y1 - 2017/5/11
N2 - The fabrication of integrated circuits (ICs) is typically outsourced to an external semiconductor foundry to reduce cost. However, this can come at the expense of trust. How can a designer ensure the integrity of the ICs fabricated by an external foundry? The talk will discuss a new approach for inspiring trust in outsourced IC fabrication by complementing the untrusted (outsourced) with an IC fabricated at a low-end but trusted foundry. This approach is referred to as split fabrication. We present two different ways in which split fabrication can be used to enhance security: logic obfuscation and verifiable ASICs.
AB - The fabrication of integrated circuits (ICs) is typically outsourced to an external semiconductor foundry to reduce cost. However, this can come at the expense of trust. How can a designer ensure the integrity of the ICs fabricated by an external foundry? The talk will discuss a new approach for inspiring trust in outsourced IC fabrication by complementing the untrusted (outsourced) with an IC fabricated at a low-end but trusted foundry. This approach is referred to as split fabrication. We present two different ways in which split fabrication can be used to enhance security: logic obfuscation and verifiable ASICs.
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U2 - 10.23919/DATE.2017.7927158
DO - 10.23919/DATE.2017.7927158
M3 - Conference contribution
AN - SCOPUS:85020209011
T3 - Proceedings of the 2017 Design, Automation and Test in Europe, DATE 2017
SP - 1128
BT - Proceedings of the 2017 Design, Automation and Test in Europe, DATE 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th Design, Automation and Test in Europe, DATE 2017
Y2 - 27 March 2017 through 31 March 2017
ER -