TY - GEN
T1 - Integration of metal-GaAs-metal photodetectors on Si using thin Ge buffer layers for applications in visible photonics
AU - Dushaq, Ghada
AU - Rasras, Mahmoud
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - Monolithic integration of III-V materials on silicon appears as the most promising, cost-effective and versatile method for the next generation of optoelectronic devices [1-3].
AB - Monolithic integration of III-V materials on silicon appears as the most promising, cost-effective and versatile method for the next generation of optoelectronic devices [1-3].
UR - http://www.scopus.com/inward/record.url?scp=85074656552&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85074656552&partnerID=8YFLogxK
U2 - 10.1109/CLEOE-EQEC.2019.8872335
DO - 10.1109/CLEOE-EQEC.2019.8872335
M3 - Conference contribution
T3 - 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019
BT - 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019
Y2 - 23 June 2019 through 27 June 2019
ER -