TY - GEN
T1 - Invited
T2 - 59th ACM/IEEE Design Automation Conference, DAC 2022
AU - Pilato, Christian
AU - Sciuto, Donatella
AU - Tan, Benjamin
AU - Garg, Siddharth
AU - Karri, Ramesh
N1 - Publisher Copyright:
© 2022 ACM.
PY - 2022/7/10
Y1 - 2022/7/10
N2 - Due to the globalization of the electronics supply chain, hardware engineers are increasingly interested in modifying their chip designs to protect their intellectual property (IP) or the privacy of the final users. However, the integration of state-of-the-art solutions for hardware and hardware-assisted security is not fully automated, requiring the amendment of stable tools and industrial toolchains. This significantly limits the application in industrial designs, potentially affecting the security of the resulting chips. We discuss how existing solutions can be adapted to implement security features at higher levels of abstractions (during high-level synthesis or directly at the register-transfer level) and complement current industrial design and verification flows. Our modular framework allows designers to compose these solutions and create additional protection layers.
AB - Due to the globalization of the electronics supply chain, hardware engineers are increasingly interested in modifying their chip designs to protect their intellectual property (IP) or the privacy of the final users. However, the integration of state-of-the-art solutions for hardware and hardware-assisted security is not fully automated, requiring the amendment of stable tools and industrial toolchains. This significantly limits the application in industrial designs, potentially affecting the security of the resulting chips. We discuss how existing solutions can be adapted to implement security features at higher levels of abstractions (during high-level synthesis or directly at the register-transfer level) and complement current industrial design and verification flows. Our modular framework allows designers to compose these solutions and create additional protection layers.
UR - http://www.scopus.com/inward/record.url?scp=85137423499&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85137423499&partnerID=8YFLogxK
U2 - 10.1145/3489517.3530635
DO - 10.1145/3489517.3530635
M3 - Conference contribution
AN - SCOPUS:85137423499
T3 - Proceedings - Design Automation Conference
SP - 1375
EP - 1378
BT - Proceedings of the 59th ACM/IEEE Design Automation Conference, DAC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 10 July 2022 through 14 July 2022
ER -