Large-Scale 3D Chips: Challenges and Solution for Design Automation, Testing, and Trustworthy Integration

Johann Knechtel, Ozgur Sinanoglu, Ibrahim (Abe) M. Elfadel, Jens Lienig, C. N Cliff

Research output: Contribution to journal › Article › peer-review

Original language	English (US)
Pages (from-to)	45-62
Journal	IPSJ Transactions on System LSI Design Methodology
Volume	10
State	Published - 2017

Cite this

@article{85354f062feb4838aa3e0ddd4a1e1ee7,

title = "Large-Scale 3D Chips: Challenges and Solution for Design Automation, Testing, and Trustworthy Integration",

author = "Johann Knechtel and Ozgur Sinanoglu and Elfadel, {Ibrahim (Abe) M.} and Jens Lienig and Cliff, {C. N}",

year = "2017",

language = "English (US)",

volume = "10",

pages = "45--62",

journal = "IPSJ Transactions on System LSI Design Methodology",

issn = "1882-6687",

publisher = "Information Processing Society of Japan",

}

TY - JOUR

T1 - Large-Scale 3D Chips

T2 - Challenges and Solution for Design Automation, Testing, and Trustworthy Integration

AU - Knechtel, Johann

AU - Sinanoglu, Ozgur

AU - Elfadel, Ibrahim (Abe) M.

AU - Lienig, Jens

AU - Cliff , C. N

PY - 2017

Y1 - 2017

M3 - Article

SN - 1882-6687

VL - 10

SP - 45

EP - 62

JO - IPSJ Transactions on System LSI Design Methodology

JF - IPSJ Transactions on System LSI Design Methodology

ER -