TY - GEN
T1 - Mask strategy and layout decomposition for self-aligned quadruple patterning
AU - Kang, Weiling
AU - Feng, Chen
AU - Chen, Yijian
PY - 2013
Y1 - 2013
N2 - Self-aligned quadruple patterning (SAQP) process is a proven technique for deep nano-scale IC manufacturing, while its mask design and layout decomposition strategy is less intuitive. In this paper, we examine both 2- and 3-mask SAQP process characteristics and develop various decomposition methods to achieve higher feature density and 2-D design flexibility. It is demonstrated that by generating assisting mandrels, SAQP layout decomposition can be degenerated into a SADP decomposition problem for which mature algorithms already exist in our EDA industry. Moreover, a spacer-expansion mask concept is introduced and a grouping/coloring algorithm to assign feature colors is developed for 3-mask SAQP layout decomposition. Finally, several 2-D layouts are successfully decomposed, showing the functionality of the decomposition method we proposed.
AB - Self-aligned quadruple patterning (SAQP) process is a proven technique for deep nano-scale IC manufacturing, while its mask design and layout decomposition strategy is less intuitive. In this paper, we examine both 2- and 3-mask SAQP process characteristics and develop various decomposition methods to achieve higher feature density and 2-D design flexibility. It is demonstrated that by generating assisting mandrels, SAQP layout decomposition can be degenerated into a SADP decomposition problem for which mature algorithms already exist in our EDA industry. Moreover, a spacer-expansion mask concept is introduced and a grouping/coloring algorithm to assign feature colors is developed for 3-mask SAQP layout decomposition. Finally, several 2-D layouts are successfully decomposed, showing the functionality of the decomposition method we proposed.
KW - Conflicting graph.
KW - Layout decomposition/synthesis
KW - Negative tone
KW - Self-aligned quadruple patterning (SAQP)
KW - Spacer-expansion mask
UR - http://www.scopus.com/inward/record.url?scp=84878570336&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84878570336&partnerID=8YFLogxK
U2 - 10.1117/12.2011261
DO - 10.1117/12.2011261
M3 - Conference contribution
AN - SCOPUS:84878570336
SN - 9780819494665
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Design for Manufacturability through Design-Process Integration VII
T2 - SPIE Conference on Designfor Manufacturability through Design-Process Integration, DfM-DPI 2013
Y2 - 27 February 2013 through 28 February 2013
ER -