MDTM: Multi-objective dynamic thermal management for on-chip systems

Heba Khdr, Thomas Ebi, Muhammad Shafique, Hussam Amrouch, Jörg Henkel Karlsruhe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thermal hot spots and unbalanced temperatures between cores on chip can cause either degradation in performance or may have a severe impact on reliability, or both. In this paper, we propose mDTM, a proactive dynamic thermal management technique for on-chip systems. It employs multi-objective management for migrating tasks in order to both prevent the system from hitting an undesirable thermal threshold and to balance the temperatures between the cores. Our evaluation on the Intel SCC platform shows that mDTM can successfully avoid a given thermal threshold and reduce spatial thermal variation by 22%. Compared to state-of-the-art, our mDTM achieves up to 58% performance gain. Additionally, we deploy an FPGA and IR camera based setup to analyze the effectiveness of our technique.

Original languageEnglish (US)
Title of host publicationProceedings - Design, Automation and Test in Europe, DATE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9783981537024
DOIs
StatePublished - 2014
Event17th Design, Automation and Test in Europe, DATE 2014 - Dresden, Germany
Duration: Mar 24 2014Mar 28 2014

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Other

Other17th Design, Automation and Test in Europe, DATE 2014
CountryGermany
CityDresden
Period3/24/143/28/14

ASJC Scopus subject areas

  • Engineering(all)

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