TY - GEN
T1 - MDTM
T2 - 17th Design, Automation and Test in Europe, DATE 2014
AU - Khdr, Heba
AU - Ebi, Thomas
AU - Shafique, Muhammad
AU - Amrouch, Hussam
AU - Karlsruhe, Jörg Henkel
N1 - Copyright:
Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2014
Y1 - 2014
N2 - Thermal hot spots and unbalanced temperatures between cores on chip can cause either degradation in performance or may have a severe impact on reliability, or both. In this paper, we propose mDTM, a proactive dynamic thermal management technique for on-chip systems. It employs multi-objective management for migrating tasks in order to both prevent the system from hitting an undesirable thermal threshold and to balance the temperatures between the cores. Our evaluation on the Intel SCC platform shows that mDTM can successfully avoid a given thermal threshold and reduce spatial thermal variation by 22%. Compared to state-of-the-art, our mDTM achieves up to 58% performance gain. Additionally, we deploy an FPGA and IR camera based setup to analyze the effectiveness of our technique.
AB - Thermal hot spots and unbalanced temperatures between cores on chip can cause either degradation in performance or may have a severe impact on reliability, or both. In this paper, we propose mDTM, a proactive dynamic thermal management technique for on-chip systems. It employs multi-objective management for migrating tasks in order to both prevent the system from hitting an undesirable thermal threshold and to balance the temperatures between the cores. Our evaluation on the Intel SCC platform shows that mDTM can successfully avoid a given thermal threshold and reduce spatial thermal variation by 22%. Compared to state-of-the-art, our mDTM achieves up to 58% performance gain. Additionally, we deploy an FPGA and IR camera based setup to analyze the effectiveness of our technique.
UR - http://www.scopus.com/inward/record.url?scp=84903837551&partnerID=8YFLogxK
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U2 - 10.7873/DATE2014.343
DO - 10.7873/DATE2014.343
M3 - Conference contribution
AN - SCOPUS:84903837551
SN - 9783981537024
T3 - Proceedings -Design, Automation and Test in Europe, DATE
BT - Proceedings - Design, Automation and Test in Europe, DATE 2014
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 24 March 2014 through 28 March 2014
ER -