Micromachining of silicon for thermal and position-sensitive nuclear detector applications

Ylva Bäcklund, Noël J. Coron, Per Delsing, Björn Jonson, Mats Lindroos, Göran Nyman, Helge Ravn, Karsten Riisager, Henry H. Stroke

    Research output: Contribution to journalArticlepeer-review

    Abstract

    As part of a programme aiming at the development of small nuclear radiation detectors, for example thermal detectors and position sensitive mosaic structures of surface barrier type, a technique for micromachining the detector bodies in silicon has been developed. The technique is based on an anisotropic etching property of a solution, mainly consisting of KOH. The etch rate is strongly orientation dependent with a speed in the 〈100〉 direction about 400 times faster than in the 〈111〉 direction. The major steps in the etching procedure are described and some examples of deep etching in Si are shown.

    Original languageEnglish (US)
    Pages (from-to)555-559
    Number of pages5
    JournalNuclear Inst. and Methods in Physics Research, A
    Volume279
    Issue number3
    DOIs
    StatePublished - Jul 15 1989

    ASJC Scopus subject areas

    • Nuclear and High Energy Physics
    • Instrumentation

    Fingerprint Dive into the research topics of 'Micromachining of silicon for thermal and position-sensitive nuclear detector applications'. Together they form a unique fingerprint.

    Cite this