TY - JOUR
T1 - Microwave-Enabled Wearables
T2 - Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap
AU - Wagih, Mahmoud
AU - Balocchi, Leonardo
AU - Benassi, Francesca
AU - Carvalho, Nuno B.
AU - Chiao, Jung Chih
AU - Correia, Ricardo
AU - Costanzo, Alessandra
AU - Cui, Yepu
AU - Georgiadou, Dimitra
AU - Gouveia, Carolina
AU - Grosinger, Jasmin
AU - Ho, John S.
AU - Hu, Kexin
AU - Komolafe, Abiodun
AU - Lemey, Sam
AU - Loss, Caroline
AU - Marrocco, Gaetano
AU - Mitcheson, Paul
AU - Palazzi, Valentina
AU - Panunzio, Nicoletta
AU - Paolini, Giacomo
AU - Pinho, Pedro
AU - Preishuber-Pflugl, Josef
AU - Qaragoez, Yasser
AU - Rahmani, Hamed
AU - Rogier, Hendrik
AU - Lopera, Jose Romero
AU - Roselli, Luca
AU - Schreurs, Dominique
AU - Tentzeris, Manos
AU - Tian, Xi
AU - Torah, Russel
AU - Torres, Ricardo
AU - Van Torre, Patrick
AU - Vital, Dieff
AU - Beeby, Steve
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2023/1/1
Y1 - 2023/1/1
N2 - This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devices integrated into clothing, which require interdisciplinary research efforts to emerge. Microwaves, the 'interconnect' of wireless networks, can enable, rather than solely connect, the next generation of autonomous, sustainable, and wearable-friendly electronics. First, enabling technologies including wireless power transmission and RF energy harvesting, backscattering and passive communication, RFID, and electromagnetic sensing are reviewed. We then discuss the key integration platforms, covering smart fabrics and electronic textiles, additive manufacturing, printed electronics, natively-flexible and organic RF semiconductors, and fully-integrated CMOS systems, where opportunities for hybrid integration are highlighted. The emerging research trends, from mmWave 6G, RF sensing and imaging, to healthcare applications including neural implants, drug delivery, and safety upon exposure to microwaves are re-visited and discussed, presenting a future roadmap for interdisciplinary research towards sustainable and reliable next-generation wearables.
AB - This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devices integrated into clothing, which require interdisciplinary research efforts to emerge. Microwaves, the 'interconnect' of wireless networks, can enable, rather than solely connect, the next generation of autonomous, sustainable, and wearable-friendly electronics. First, enabling technologies including wireless power transmission and RF energy harvesting, backscattering and passive communication, RFID, and electromagnetic sensing are reviewed. We then discuss the key integration platforms, covering smart fabrics and electronic textiles, additive manufacturing, printed electronics, natively-flexible and organic RF semiconductors, and fully-integrated CMOS systems, where opportunities for hybrid integration are highlighted. The emerging research trends, from mmWave 6G, RF sensing and imaging, to healthcare applications including neural implants, drug delivery, and safety upon exposure to microwaves are re-visited and discussed, presenting a future roadmap for interdisciplinary research towards sustainable and reliable next-generation wearables.
KW - Additive manufacturing
KW - antennas
KW - backscattering
KW - E-textiles
KW - energy harvesting
KW - flexible semiconductors
KW - harmonic transponders
KW - microwave power transmission
KW - MTT 70th Anniversary Special Issue
KW - printed electronics
KW - rectennas
KW - RF sensing
KW - RFID
KW - sustainable electronics
KW - wearable electronics
UR - http://www.scopus.com/inward/record.url?scp=85149789523&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85149789523&partnerID=8YFLogxK
U2 - 10.1109/JMW.2022.3223254
DO - 10.1109/JMW.2022.3223254
M3 - Article
AN - SCOPUS:85149789523
SN - 2692-8388
VL - 3
SP - 193
EP - 226
JO - IEEE Journal of Microwaves
JF - IEEE Journal of Microwaves
IS - 1
ER -