Mitigating the impact of process variation on the performance of 3-D integrated circuits

Siddharth Garg, Diana Marculescu

Research output: Contribution to journalArticle

Abstract

Three-dimensional die-stacking architectures have been proposed as a promising solution to the increasing interconnect delay that is observed in scaled technologies. Although prior research has extensively evaluated the performance advantage of moving from a 2-D to a 3-D design style, the impact of process parameter variations on 3-D designs has not been studied in detail. In this paper, we attempt to bridge this gap by proposing a variability-aware design framework for fully synchronous (FS) and multiple clock-domain (MCD) 3-D systems. To mitigate the impact of process variations on 3-D designs, we propose the variability-aware 3-D integration strategy for MCD 3-D systems that maximizes the probability of the design meeting specified system performance constraints. The proposed optimization strategy is shown to significantly outperform the FS and MCD 3-D implementations that are conventionally assembled, for example, the MCD designs assembled with the proposed integration strategy provide, on average, 44% and 16.33% higher absolute yield than the FS and conventional MCD designs, respectively, at the 50% yield point of the conventional MCD designs.

Original languageEnglish (US)
Article number6410051
Pages (from-to)1903-1914
Number of pages12
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume21
Issue number10
DOIs
StatePublished - 2013

Keywords

  • 3-D integrated circuits
  • CMOS process
  • VLSI
  • electronic design automation
  • process variations

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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