Mitigating the power density and temperature problems in the nano-era

Muhammad Shafique, Jorg Henkel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper introduces the power-density and temperature induced issues in the modern on-chip systems. In particular, the emerging Dark Silicon problem is discussed along with critical research challenges. Afterwards, an overview of key research efforts and concepts is presented that leverage dark silicon for performance and reliability optimization. In case temperature constraints are violated, an efficient dynamic thermal management technique is employed.

Original languageEnglish (US)
Title of host publication2015 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages176-177
Number of pages2
ISBN (Electronic)9781467383882
DOIs
StatePublished - Jan 5 2016
Event34th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015 - Austin, United States
Duration: Nov 2 2015Nov 6 2015

Publication series

Name2015 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015

Other

Other34th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015
CountryUnited States
CityAustin
Period11/2/1511/6/15

Keywords

  • Aging
  • Boosting
  • Dark Silicon
  • Efficiency
  • Performance
  • Power
  • Power Density
  • Reliability
  • Soft Errors
  • Temperature

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design

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