Modeling of Plasma Etching Reactors Including Wafer Heating Effects

Engineering & Materials Science

• Plasma etching 100%
• Chlorine 82%
• Polysilicon 77%
• Etching 72%
• Laser interferometry 55%
• Heating 48%
• Surface reactions 48%
• Cooling 46%
• Plasmas 30%
• Temperature 26%
• Mathematical models 23%
• Hot Temperature 16%

Physics & Astronomy

• plasma etching 75%
• reactors 50%
• wafers 50%
• heating 42%
• chlorine 23%
• etching 16%
• cooling 15%
• laser interferometry 14%
• etchants 13%
• surface reactions 11%
• mathematical models 9%
• heat 7%
• temperature 6%
• predictions 6%

Chemical Compounds

• Etching 60%
• Plasma 41%
• Laser Interferometry 39%
• Chlorine 39%
• Reaction Parameter 23%
• Surface Reaction 23%
• Heat 16%