Multi-layer dependability: From microarchitecture to application level

Jörg Henkel; Lars Bauer; Hongyan Zhang; Semeen Rehman; Muhammad Shafique

doi:10.1145/2593069.2596683

Multi-layer dependability: From microarchitecture to application level

Jörg Henkel, Lars Bauer, Hongyan Zhang, Semeen Rehman, Muhammad Shafique

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We show in this paper that multi-layer dependability is an indispensable way to cope with the increasing amount of technology-induced dependability problems that threaten to proceed further scaling. We introduce the definition of multi-layer dependability and present our design flow within this paradigm that seamlessly integrates techniques starting at circuit layer all the way up to application layer and thereby accounting for ASIC-based architectures as well as for reconfigurable-based architectures. At the end, we give evidence that the paradigm of multi-layer dependability bears a large potential for significantly increasing dependability at reasonable effort.

Original language	English (US)
Title of host publication	DAC 2014 - 51st Design Automation Conference, Conference Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781479930173
DOIs	https://doi.org/10.1145/2593069.2596683
State	Published - 2014
Event	51st Annual Design Automation Conference, DAC 2014 - San Francisco, CA, United States Duration: Jun 2 2014 → Jun 5 2014

Publication series

Name	Proceedings - Design Automation Conference
ISSN (Print)	0738-100X

Other

Other	51st Annual Design Automation Conference, DAC 2014
Country/Territory	United States
City	San Francisco, CA
Period	6/2/14 → 6/5/14

ASJC Scopus subject areas

Computer Science Applications
Control and Systems Engineering
Electrical and Electronic Engineering
Modeling and Simulation

Access to Document

10.1145/2593069.2596683

Cite this

Henkel, J., Bauer, L., Zhang, H., Rehman, S., & Shafique, M. (2014). Multi-layer dependability: From microarchitecture to application level. In DAC 2014 - 51st Design Automation Conference, Conference Proceedings Article 2596683 (Proceedings - Design Automation Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1145/2593069.2596683

Multi-layer dependability: From microarchitecture to application level. / Henkel, Jörg; Bauer, Lars; Zhang, Hongyan et al.
DAC 2014 - 51st Design Automation Conference, Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 2014. 2596683 (Proceedings - Design Automation Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Henkel, J, Bauer, L, Zhang, H, Rehman, S & Shafique, M 2014, Multi-layer dependability: From microarchitecture to application level. in DAC 2014 - 51st Design Automation Conference, Conference Proceedings., 2596683, Proceedings - Design Automation Conference, Institute of Electrical and Electronics Engineers Inc., 51st Annual Design Automation Conference, DAC 2014, San Francisco, CA, United States, 6/2/14. https://doi.org/10.1145/2593069.2596683

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AB - We show in this paper that multi-layer dependability is an indispensable way to cope with the increasing amount of technology-induced dependability problems that threaten to proceed further scaling. We introduce the definition of multi-layer dependability and present our design flow within this paradigm that seamlessly integrates techniques starting at circuit layer all the way up to application layer and thereby accounting for ASIC-based architectures as well as for reconfigurable-based architectures. At the end, we give evidence that the paradigm of multi-layer dependability bears a large potential for significantly increasing dependability at reasonable effort.

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Multi-layer dependability: From microarchitecture to application level

Abstract

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ASJC Scopus subject areas

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