Multilayer integration of microwave and millimeter wave circuits: New interconnect methods and design considerations

Nirod Das, N Herscovici, G Kwan, DM Bolle

Research output: Chapter in Book/Report/Conference proceedingChapter (peer-reviewed)peer-review

Original languageEnglish (US)
Title of host publicationDirections for the next generation of MMIC devices and systems
EditorsNK Das, HL Bertoni
Place of PublicationNew York
PublisherPlenum Press
StatePublished - May 1997

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