New trends in dark silicon

Jörg Henkel, Heba Khdr, Santiago Pagani, Muhammad Shafique

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents new trends in dark silicon reflecting, among others, the deployment of FinFETs in recent technology nodes and the impact of voltage/frquency scaling, which lead to new less-conservative predictions. The focus is on dark silicon from a thermal perspective: we show that it is not simply the chIP's total power budget, e.g., the Thermal Design Power (TDP), that leads to the dark silicon problem, but instead it is the power density and related thermal effects. We therefore propose to use Thermal Safe Power (TSP) as a more efficient power budget. It is also shown that sophisticated spatio-temporal mapping decisions result in improved thermal profiles with reduced peak temperatures. Moreover, we discuss the implications of Near-Threshold Computing (NTC) and employment of Boosting techniques in dark silicon systems.

Original languageEnglish (US)
Title of host publication2015 52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450335201
StatePublished - Jul 24 2015
Event52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015 - San Francisco, United States
Duration: Jun 8 2015Jun 12 2015

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X


Other52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015
Country/TerritoryUnited States
CitySan Francisco

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modeling and Simulation


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