On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity

Johann Knechtel, Ozgur Sinanoglu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on efficient implementations of classical SCA countermeasures. That is, SCAs tailored for up-and-coming 3D ICs have been overlooked so far. In this paper, we conduct such a novel study and focus on one of the most accessible and critical side channels: thermal leakage of activity and power patterns. We address the thermal leakage in 3D ICs early on during floorplanning, along with tailored extensions for power and thermal management. Our key idea is to carefully exploit the specifics of material and structural properties in 3D ICs, thereby decorrelating the thermal behaviour from underlying power and activity patterns. Most importantly, we discuss powerful SCAs and demonstrate how our open-source tool helps to mitigate them.

Original languageEnglish (US)
Title of host publicationProceedings of the 54th Annual Design Automation Conference 2017, DAC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450349277
DOIs
StatePublished - Jun 18 2017
Event54th Annual Design Automation Conference, DAC 2017 - Austin, United States
Duration: Jun 18 2017Jun 22 2017

Publication series

NameProceedings - Design Automation Conference
VolumePart 128280
ISSN (Print)0738-100X

Other

Other54th Annual Design Automation Conference, DAC 2017
CountryUnited States
CityAustin
Period6/18/176/22/17

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modeling and Simulation

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