TY - JOUR
T1 - Patterning metal contacts on monolayer MoS 2 with vanishing Schottky barriers using thermal nanolithography
AU - Zheng, Xiaorui
AU - Calò, Annalisa
AU - Albisetti, Edoardo
AU - Liu, Xiangyu
AU - Alharbi, Abdullah Sanad M.
AU - Arefe, Ghidewon
AU - Liu, Xiaochi
AU - Spieser, Martin
AU - Yoo, Won Jong
AU - Taniguchi, Takashi
AU - Watanabe, Kenji
AU - Aruta, Carmela
AU - Ciarrocchi, Alberto
AU - Kis, Andras
AU - Lee, Brian S.
AU - Lipson, Michal
AU - Hone, James
AU - Shahrjerdi, Davood
AU - Riedo, Elisa
N1 - Publisher Copyright:
© 2019, The Author(s), under exclusive licence to Springer Nature Limited.
PY - 2019/1/1
Y1 - 2019/1/1
N2 - Two-dimensional semiconductors, such as molybdenum disulfide (MoS 2 ), exhibit a variety of properties that could be useful in the development of novel electronic devices. However, nanopatterning metal electrodes on such atomic layers, which is typically achieved using electron beam lithography, is currently problematic, leading to non-ohmic contacts and high Schottky barriers. Here, we show that thermal scanning probe lithography can be used to pattern metal electrodes with high reproducibility, sub-10-nm resolution, and high throughput (10 5 μm 2 h −1 per single probe). The approach, which offers simultaneous in situ imaging and patterning, does not require a vacuum, high energy, or charged beams, in contrast to electron beam lithography. Using this technique, we pattern metal electrodes in direct contact with monolayer MoS 2 for top-gate and back-gate field-effect transistors. These devices exhibit vanishing Schottky barrier heights (around 0 meV), on/off ratios of 10 10 , no hysteresis, and subthreshold swings as low as 64 mV per decade without using negative capacitors or hetero-stacks.
AB - Two-dimensional semiconductors, such as molybdenum disulfide (MoS 2 ), exhibit a variety of properties that could be useful in the development of novel electronic devices. However, nanopatterning metal electrodes on such atomic layers, which is typically achieved using electron beam lithography, is currently problematic, leading to non-ohmic contacts and high Schottky barriers. Here, we show that thermal scanning probe lithography can be used to pattern metal electrodes with high reproducibility, sub-10-nm resolution, and high throughput (10 5 μm 2 h −1 per single probe). The approach, which offers simultaneous in situ imaging and patterning, does not require a vacuum, high energy, or charged beams, in contrast to electron beam lithography. Using this technique, we pattern metal electrodes in direct contact with monolayer MoS 2 for top-gate and back-gate field-effect transistors. These devices exhibit vanishing Schottky barrier heights (around 0 meV), on/off ratios of 10 10 , no hysteresis, and subthreshold swings as low as 64 mV per decade without using negative capacitors or hetero-stacks.
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U2 - 10.1038/s41928-018-0191-0
DO - 10.1038/s41928-018-0191-0
M3 - Article
AN - SCOPUS:85060271384
SN - 2520-1131
VL - 2
SP - 17
EP - 25
JO - Nature Electronics
JF - Nature Electronics
IS - 1
ER -