Quantifying the Overheads of Modular Multiplication

Deepraj Soni, Mohammed Nabeel, Negar Neda, Ramesh Karri, Michail Maniatakos, Brandon Reagen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As security and privacy continue to grow in importance, new techniques, including fully homomorphic encryption (FHE) and post-quantum cryptography (PQC), have emerged to provide new capabilities. Many of these techniques are based on the ring learning with errors problem and operate over rings. Elements of a ring are computed using modular arithmetic, with modular multiplication being a primary component. These components are far more complex than standard integer computing, especially when working with large bit widths. As FHE and PQC become increasingly popular, the need for well-designed and optimized modular multipliers also grows in importance. In this paper, we analyze the power, area, performance, energy, and thermal characteristics of two commonly used modular multipliers: Barrett (bit parallel) and Interleaved (bit parallel). To understand these multipliers' characteristics, this study provides necessary insights into the sources of area, power, frequency, and energy overhead, considering a range of different bit widths (16-256). This paper rigorously analyzes the sub-blocks of modular multipliers and their contributions to overall power, performance, and area (PPA).

Original languageEnglish (US)
Title of host publication2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350311754
DOIs
StatePublished - 2023
Event2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023 - Vienna, Austria
Duration: Aug 7 2023Aug 8 2023

Publication series

NameProceedings of the International Symposium on Low Power Electronics and Design
Volume2023-August
ISSN (Print)1533-4678

Conference

Conference2023 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2023
Country/TerritoryAustria
CityVienna
Period8/7/238/8/23

ASJC Scopus subject areas

  • General Engineering

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