Self assembled monolayer methods in the fabrication of high-Tc superconductor SNS junction nano-devices

Sungwook Kim; In Soon Chang; Fannyben Patel; John T. McDevitt

doi:10.1557/proc-872-j7.4

Self assembled monolayer methods in the fabrication of high-Tc superconductor SNS junction nano-devices

Sungwook Kim, In Soon Chang, Fannyben Patel, John T. McDevitt

Research output: Contribution to journal › Conference article › peer-review

Abstract

Although the superconductor/normal metal (SN) interface is one of the most important controlling factors in determining the performance of superconductor/normal metal/superconductor (SNS) junctions, controlling the SN interface still remains difficult. The in situ deposit techniques have been widely used to cope with this problem, but they limit the types of SNS junctions that can be explored. Soft Chemistry Etching methods were developed to fabricate the YBCO/Au/YBCO and TX-YBCO/Au/TX-YBCO SNS junction nano-devices with ex situ deposit. The planar SNS junctions controlled by such methods exhibited good transport properties above 80 K with less than 10 ^-8ω-cm² contact resistivity. The current state of the suitable fabrication methods of SNS nano-devices will be described with experiment results.

Original language	English (US)
Article number	J7.4
Pages (from-to)	97-102
Number of pages	6
Journal	Materials Research Society Symposium Proceedings
Volume	872
DOIs	https://doi.org/10.1557/proc-872-j7.4
State	Published - 2005
Event	2005 Materials Research Society Spring Meeting - San Francisco, CA, United States Duration: Mar 28 2005 → Apr 1 2005

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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Cite this

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title = "Self assembled monolayer methods in the fabrication of high-Tc superconductor SNS junction nano-devices",

abstract = "Although the superconductor/normal metal (SN) interface is one of the most important controlling factors in determining the performance of superconductor/normal metal/superconductor (SNS) junctions, controlling the SN interface still remains difficult. The in situ deposit techniques have been widely used to cope with this problem, but they limit the types of SNS junctions that can be explored. Soft Chemistry Etching methods were developed to fabricate the YBCO/Au/YBCO and TX-YBCO/Au/TX-YBCO SNS junction nano-devices with ex situ deposit. The planar SNS junctions controlled by such methods exhibited good transport properties above 80 K with less than 10 -8ω-cm2 contact resistivity. The current state of the suitable fabrication methods of SNS nano-devices will be described with experiment results.",

author = "Sungwook Kim and Chang, {In Soon} and Fannyben Patel and McDevitt, {John T.}",

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doi = "10.1557/proc-872-j7.4",

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journal = "Materials Research Society Symposium Proceedings",

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note = "2005 Materials Research Society Spring Meeting ; Conference date: 28-03-2005 Through 01-04-2005",

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AU - Kim, Sungwook

AU - Chang, In Soon

AU - Patel, Fannyben

AU - McDevitt, John T.

PY - 2005

Y1 - 2005

N2 - Although the superconductor/normal metal (SN) interface is one of the most important controlling factors in determining the performance of superconductor/normal metal/superconductor (SNS) junctions, controlling the SN interface still remains difficult. The in situ deposit techniques have been widely used to cope with this problem, but they limit the types of SNS junctions that can be explored. Soft Chemistry Etching methods were developed to fabricate the YBCO/Au/YBCO and TX-YBCO/Au/TX-YBCO SNS junction nano-devices with ex situ deposit. The planar SNS junctions controlled by such methods exhibited good transport properties above 80 K with less than 10 -8ω-cm2 contact resistivity. The current state of the suitable fabrication methods of SNS nano-devices will be described with experiment results.

AB - Although the superconductor/normal metal (SN) interface is one of the most important controlling factors in determining the performance of superconductor/normal metal/superconductor (SNS) junctions, controlling the SN interface still remains difficult. The in situ deposit techniques have been widely used to cope with this problem, but they limit the types of SNS junctions that can be explored. Soft Chemistry Etching methods were developed to fabricate the YBCO/Au/YBCO and TX-YBCO/Au/TX-YBCO SNS junction nano-devices with ex situ deposit. The planar SNS junctions controlled by such methods exhibited good transport properties above 80 K with less than 10 -8ω-cm2 contact resistivity. The current state of the suitable fabrication methods of SNS nano-devices will be described with experiment results.

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ER -

Self assembled monolayer methods in the fabrication of high-Tc superconductor SNS junction nano-devices

Abstract

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