Special session 4A: New topics parametric yield and reliability of 3D integrated circuits: New challenges and solutions

Siddharth Garg, Diana Marculescu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

3D integration is a promising new technology that offers numerous potential benefits including reduced wire length, high tier-to-tier bandwidth and low latency, and the possibility for heterogeneous integration of disparate technologies. As a result, 3D integrated circuits (IC) are being aggressively investigated as a potential replacement for conventional planar ICs in both academia and industry.

Original languageEnglish (US)
Title of host publicationProceedings - 2011 29th IEEE VLSI Test Symposium, VTS 2011
Number of pages1
DOIs
StatePublished - 2011
Event2011 29th IEEE VLSI Test Symposium, VTS 2011 - Dana Point, CA, United States
Duration: May 1 2011May 5 2011

Publication series

NameProceedings of the IEEE VLSI Test Symposium

Other

Other2011 29th IEEE VLSI Test Symposium, VTS 2011
CountryUnited States
CityDana Point, CA
Period5/1/115/5/11

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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  • Cite this

    Garg, S., & Marculescu, D. (2011). Special session 4A: New topics parametric yield and reliability of 3D integrated circuits: New challenges and solutions. In Proceedings - 2011 29th IEEE VLSI Test Symposium, VTS 2011 [5783764] (Proceedings of the IEEE VLSI Test Symposium). https://doi.org/10.1109/VTS.2011.5783764