TY - GEN
T1 - Special session 4A
T2 - 2011 29th IEEE VLSI Test Symposium, VTS 2011
AU - Garg, Siddharth
AU - Marculescu, Diana
PY - 2011
Y1 - 2011
N2 - 3D integration is a promising new technology that offers numerous potential benefits including reduced wire length, high tier-to-tier bandwidth and low latency, and the possibility for heterogeneous integration of disparate technologies. As a result, 3D integrated circuits (IC) are being aggressively investigated as a potential replacement for conventional planar ICs in both academia and industry.
AB - 3D integration is a promising new technology that offers numerous potential benefits including reduced wire length, high tier-to-tier bandwidth and low latency, and the possibility for heterogeneous integration of disparate technologies. As a result, 3D integrated circuits (IC) are being aggressively investigated as a potential replacement for conventional planar ICs in both academia and industry.
UR - http://www.scopus.com/inward/record.url?scp=79959684141&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79959684141&partnerID=8YFLogxK
U2 - 10.1109/VTS.2011.5783764
DO - 10.1109/VTS.2011.5783764
M3 - Conference contribution
AN - SCOPUS:79959684141
SN - 9781612846552
T3 - Proceedings of the IEEE VLSI Test Symposium
BT - Proceedings - 2011 29th IEEE VLSI Test Symposium, VTS 2011
Y2 - 1 May 2011 through 5 May 2011
ER -