TY - GEN
T1 - Special session
T2 - 39th IEEE VLSI Test Symposium, VTS 2021
AU - Amrouch, Hussam
AU - Chowdhury, Animesh Basak
AU - Jin, Wentian
AU - Karri, Ramesh
AU - Khorrami, Farshad
AU - Krishnamurthy, Prashanth
AU - Polian, Ilia
AU - Van Santen, Victor M.
AU - Tan, Benjamin
AU - Tan, Sheldon X.D.
N1 - Funding Information:
The work of H. Amrouch, V. M. van Santen, and I. Polian was partially supported by Advantest as part of the Graduate School “Intelligent Methods for Test and Reliability” (GS-IMTR) at the University of Stuttgart. This work was supported in part by the Office of Naval Research (ONR) under Grant N00014-18-1-2672.
Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/25
Y1 - 2021/4/25
N2 - With technology scaling approaching atomic levels, IC test and diagnosis of complex System-on-Chips (SoCs) become overwhelming challenging. In addition, sustaining the reliability of transistors as well as circuits at such extreme feature sizes, for the entire projected lifetime, also become profoundly difficult. This holds even more when it comes to emerging technologies that go beyond convectional CMOS in which the underlying physics are not yet fully understood. In this special session paper, we describe the usage of machine learning in several test and reliability related areas. First, we demonstrate the vital role that machine learning can play in IC test showing the importance of explainability as a frontier for machine learning in IC test. Afterwards, we discuss how novel physics-informed neural networks can be employed to model electrostatic problems in VLSI designs. This is essential to mitigate the deleterious effects of of time dependent dielectric breakdown, which is the key source of reliability degradations. Finally, we discuss the major sources of reliability degradations at the transistor level in advanced technology nodes such as transistor aging phenomena and self-heating effects as well as we demonstrate how machine learning approaches can further help in developing reliable emerging technologies.
AB - With technology scaling approaching atomic levels, IC test and diagnosis of complex System-on-Chips (SoCs) become overwhelming challenging. In addition, sustaining the reliability of transistors as well as circuits at such extreme feature sizes, for the entire projected lifetime, also become profoundly difficult. This holds even more when it comes to emerging technologies that go beyond convectional CMOS in which the underlying physics are not yet fully understood. In this special session paper, we describe the usage of machine learning in several test and reliability related areas. First, we demonstrate the vital role that machine learning can play in IC test showing the importance of explainability as a frontier for machine learning in IC test. Afterwards, we discuss how novel physics-informed neural networks can be employed to model electrostatic problems in VLSI designs. This is essential to mitigate the deleterious effects of of time dependent dielectric breakdown, which is the key source of reliability degradations. Finally, we discuss the major sources of reliability degradations at the transistor level in advanced technology nodes such as transistor aging phenomena and self-heating effects as well as we demonstrate how machine learning approaches can further help in developing reliable emerging technologies.
KW - BTI
KW - Electromigration
KW - Emerging Technology
KW - HCI
KW - IC Test
KW - Machine learning
KW - Reliability
UR - http://www.scopus.com/inward/record.url?scp=85107503418&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85107503418&partnerID=8YFLogxK
U2 - 10.1109/VTS50974.2021.9441052
DO - 10.1109/VTS50974.2021.9441052
M3 - Conference contribution
AN - SCOPUS:85107503418
T3 - Proceedings of the IEEE VLSI Test Symposium
BT - Proceedings - 2021 IEEE 39th VLSI Test Symposium, VTS 2021
PB - IEEE Computer Society
Y2 - 26 April 2021 through 28 April 2021
ER -